AD6650/PCB Analog Devices Inc, AD6650/PCB Datasheet - Page 28
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AD6650/PCB
Manufacturer Part Number
AD6650/PCB
Description
BOARD EVAL FOR AD6650 W/SOFTWARE
Manufacturer
Analog Devices Inc
Datasheet
1.AD6650PCB.pdf
(44 pages)
Specifications of AD6650/PCB
Rohs Status
RoHS non-compliant
Module/board Type
Evaluation Board
For Use With/related Products
AD6650
AD6650
An additional parameter that strongly impacts the PSRR is the
sensitivity to the AVDD voltage level. A plot of spur level versus
AVDD is shown below in Figure 41. Note that this plot also has
the spur level referenced to 1mV rms supply ripple and is
referred to the LO. Thus, this plot shows a transfer function
rather than an absolute value. The spurious level can be
extrapolated to any supply ripple level from this plot using
Equation 21.
The AD6650 has separate digital and analog power supply pins.
The analog supplies are denoted AVDD, and the digital supply
pins are denoted DVDD. Although analog and digital supplies
can be tied together, best performance is achieved when the
supplies are separate because the fast digital output swings can
couple switching current back into the analog supplies. Note
that AVDD and DVDD must be held between 3.0 V and 3.45 V.
–35
–40
–45
–50
–55
–60
–65
–70
–75
–20
–23
–26
–29
–32
–35
–38
–41
–44
–47
–50
Figure 40. Output Spurious vs. Power Supply Ripple (AIN = 199 MHz)
Figure 41. Output Spurious vs. Power Supply Ripple (AIN = 199 MHz)
2.95
1
3.00 3.05 3.10 3.15 3.20 3.25 3.30 3.35 3.40 3.45 3.50 3.55
OFFSET FREQUENCY (kHz)
10
AVDD (V)
100
1000
3.60
Rev. A | Page 28 of 44
DIGITAL OUTPUTS
It is recommended that the digital outputs drive a series resistor
(for example, 100 Ω). To minimize capacitive loading, the
number of gates on each output pin should be limited. The
series resistors should be placed as close to the AD6650 as
possible to limit the amount of current that can flow into the
output stage. These switching currents are confined between
ground and the DVDD pin. Also, note that excessive capacitive
loading increases output timing and can invalidate timing
specifications.
GROUNDING
For optimum performance, it is highly recommended to use a
split ground between the analog and digital grounds. AGND
should be connected to the analog ground of the RF board, and
DGND should be connected to the digital ground of the RF board.
To minimize the potential for noise coupling, it is highly
recommended to place multiple ground return traces and vias
so that the digital output currents do not flow back toward the
analog front end, but instead are routed quickly away from the
AD6650. This can be accomplished by simply placing
substantial ground connections directly back to the supply at a
point between the analog front end and the digital outputs.
Judicious use of ceramic chip capacitors between the power
supply and ground planes also helps suppress digital noise. The
layout should incorporate enough bulk capacitance to supply
the peak current requirements during switching periods.
LAYOUT INFORMATION
A multilayer board should be utilized to achieve optimal results.
It is highly recommended to use high quality ceramic chip
capacitors to decouple each supply pin to ground directly at the
device. The pin arrangement of the AD6650 facilitates ease of
use in the implementation of high frequency, high resolution
design practices. All of the digital outputs are on the opposite
side of the package from the analog inputs for isolation purposes.
Care should be taken when routing the digital output traces. To
prevent coupling through the digital outputs into the analog
portion of the AD6650, minimal capacitive loading should be
placed on these outputs.
The layout of the encode circuit is equally critical. Any noise
received on this circuitry results in corruption in the digitization
process and lower overall performance. The encode clock must
be isolated from the digital outputs and the analog inputs.