TEF6903AH/V5S,557 NXP Semiconductors, TEF6903AH/V5S,557 Datasheet - Page 106
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TEF6903AH/V5S,557
Manufacturer Part Number
TEF6903AH/V5S,557
Description
IC CAR RADIO SGL CHIP CIRC 80QFP
Manufacturer
NXP Semiconductors
Specifications of TEF6903AH/V5S,557
Modulation Or Protocol
AM, FM, WB
Applications
AM/FM Radio Receiver
Current - Receiving
102mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Voltage - Supply
8 V ~ 9 V
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Frequency
-
Sensitivity
-
Memory Size
-
Data Rate - Maximum
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
935288823557
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TEF6903A_3
Product data sheet
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 116. SnPb eutectic process (from J-STD-020C)
Table 117. Lead-free process (from J-STD-020C)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 116
and
Figure
117
46.
Rev. 03 — 3 April 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
46) than a PbSn process, thus
220
220
350
TEF6903A
Integrated car radio
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
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