UAA3201T/V1,118 NXP Semiconductors, UAA3201T/V1,118 Datasheet - Page 18

• Manufacturer Part Number: UAA3201T/V1,118
• Description: IC REMOTE RECVR UHF/VHF 16SOIC
• Manufacturer: NXP Semiconductors

Specifications of UAA3201T/V1,118

• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Frequency: 150MHz ~ 450MHz
• Sensitivity: -105dBm
• Data Rate - Maximum: 250 bps
• Modulation Or Protocol: ASK
• Applications: AM/FM Radio Receiver
• Current - Receiving: 3.4mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Voltage - Supply: 3.5 V ~ 6.0 V
• Operating Temperature: -40°C ~ 85°C
• Operating Supply Voltage: 5 V
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Memory Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935076810118; UAA3201TD-T; UAA3201TD-T

Philips Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2000 Apr 18
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
UHF/VHF remote control receiver
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
, SO, SOJ
PACKAGE
18
not suitable
not suitable
suitable
not recommended
not recommended
WAVE
(2)
SOLDERING METHOD
(3)(4)
(5)
suitable
suitable
suitable
suitable
suitable
Product specification
UAA3201T
REFLOW
(1)