EM351-MOD-RF-TG Ember, EM351-MOD-RF-TG Datasheet - Page 224
EM351-MOD-RF-TG
Manufacturer Part Number
EM351-MOD-RF-TG
Description
MODULE EM351 NO PA/LNA W/RF CONN
Manufacturer
Ember
Specifications of EM351-MOD-RF-TG
Frequency
2.4GHz
Data Rate - Maximum
250kbps
Modulation Or Protocol
802.15.4 Zigbee
Power - Output
3dBm
Sensitivity
-100dBm
Voltage - Supply
2.1 V ~ 3.6 V
Current - Receiving
26mA
Current - Transmitting
31mA
Data Interface
PCB, Surface Mount
Memory Size
128kB Flash, 12kB RAM
Antenna Connector
PCB, Surface Mount
Operating Temperature
-40°C ~ 85°C
Package / Case
Module
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Applications
-
Other names
636-1015
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- Download datasheet (12Mb)
EM351 / EM357
18 Typical Application
Figure 18-1 illustrates the typical application circuit, and Table 18-1 contains an example Bill of Materials
(BOM) for the off-chip components required by the EM35x.
Note: The circuit shown in Figure 18-1 is for example purposes only, and the BOM is for budgetary quotes
only. For a complete reference design, please download one of the latest Ember Reference Designs from the
Ember website (www.ember.com).
The Balun provides an impedance transformation from the antenna to the EM35x for both Tx and Rx modes.
L1 tunes the impedance presented to the RF port for maximum transmit power and receive sensitivity.
The harmonic filter (L2, L3, C5, C6 and C9) provides additional suppression of the second harmonic, which
increases the margin over the FCC limit.
The 24 MHz crystal Y1 with loading capacitors is required and provides the high-frequency crystal oscillator
source for the EM35x’s main system clock. The 32.768 kHz crystal with loading capacitors generates a highly
accurate low-frequency crystal oscillator for use with peripherals, but it is not mandatory as the low-
frequency internal RC oscillator can be used.
Loading capacitance and ESR (C1 and R3) provides stability for the internal 1.8 V regulator.
Loading capacitance C2 provides stability for the internal 1.25 V regulator, no ESR is required because it is
contained within the chip.
Resistor R1 reduces the operating voltage of the flash memory, this reduces current consumption and
improves sensitivity by 1 dB when compared to not using it.
Various decoupling capacitors are required, these should be placed as close to their corresponding pins as
possible. For values and locations see one of the latest reference designs.
An antenna matched to 50 Ω is required.
18-1
120-035X-000G
Final
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