XT09-SI-MESH Digi International, XT09-SI-MESH Datasheet - Page 70

• Manufacturer Part Number: XT09-SI-MESH
• Description: MODULE RF 900MHZ 1W 115K W/RPSMA
• Manufacturer: Digi International

Specifications of XT09-SI-MESH

• Frequency: 900MHz
• Modulation Or Protocol: FHSS, FSK
• Power - Output: 1W
• Sensitivity: -100dBm
• Voltage - Supply: 2.8 V ~ 5.5 V
• Current - Receiving: 80mA
• Antenna Connector: RP-SMA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Applications: -
• Memory Size: -
• Data Interface: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 602-1183

Figure B‐03. DIP Switch Settings of the XTIB‐R (RS‐232/485) Interface Board
XTend™ RF Module ‐ Product Manual v2.x6x
Figure B‐01. Front View
Figure B‐02. Back View
B‐01a.
Config Switch
XTIB-R RS-232/485 Interface Board
B‐01b.
I/O & Power LEDs
B‐01c.
DB‐9 Serial Port
B‐02a.
DIP Switch
B‐01d
RSSI LEDs
© 2010 Digi Internatonal, Inc.
B‐01e.
Power Connector
B-01a. Config (Configuration) Switch
B-01b. I/O & Power LEDs
B-01c. DB-9 Serial Port
B-01d. RSSI LEDs
B-01e. Power Connector
B-02a. DIP Switch
The Config Switch provides an alternate method for entering into
Command Mode. To enter Command Mode at the module's default RF
data rate, hold the Configuration Switch down for two seconds.
The LEDs visualize gigantic status information and indicate module
activity as follows:
Standard female DB-9 (RS-232) connector. This connector can also
be used for RS-485 and RS-422 connections.
RSSI LEDs indicate the amount of fade margin present in an active
wireless link. Fade margin is defined as the difference between the
incoming signal strength and the module's receiver sensitivity.
7-28 VDC power connector (Center positive, 5.5/2.1mm)
Note: The XTIB-R interface board can accept voltages as low as 5V.
Contact Digi Technical Support to enable this option.
DIP Switch automatically configures the module to operate in differ-
ent modes during the power-on sequence. Each time the module
assembly (interface board + module) is powered-on, intelligence on
the board programs the attached module according to the positions of
the DIP Switch.
Figure B-03 illustrates DIP Switch settings. Table B-02 summarizes
the configurations triggered by the positions of the DIP Switch.
Yellow (top LED) = Serial Data Out (to host)
Green (middle) = Serial Data In (from host)
Red (bottom)
powered; it pulses on/off briefly during RF transmission.))
3 LEDs ON
2 LEDs ON
1 LED ON
0 LED ON
= Very Strong Signal (> 30 dB fade margin)
= Strong Signal (> 20 dB fade margin)
= Moderate Signal (> 10 dB fade margin)
= Weak Signal (< 10 dB fade margin)
= Power/TX Indicator (Red light is on when
Refer to the tables in the ‘Automatic
DIP Switch Configurations’ section
the DIP Switch (during power‐up).
tions triggered by the positions of
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