GS-BT2416C1.H STMicroelectronics, GS-BT2416C1.H Datasheet

IC BLUETOOTH MOD CLASS 1 HCI FW

GS-BT2416C1.H

Manufacturer Part Number
GS-BT2416C1.H
Description
IC BLUETOOTH MOD CLASS 1 HCI FW
Manufacturer
STMicroelectronics
Datasheet

Specifications of GS-BT2416C1.H

Frequency
2.4GHz
Data Rate - Maximum
721kbps
Modulation Or Protocol
Bluetooth v2.1+EDR, class 1
Applications
General Purpose
Power - Output
20dBm
Sensitivity
-84dBm
Voltage - Supply
3.3V
Current - Receiving
60mA
Current - Transmitting
180mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Operating Temperature
-20°C ~ 70°C
Package / Case
Module
Processor Series
STLC2500
Wireless Frequency
2.4 GHz to 2.5 GHz
Interface Type
SPI, I2C, UART, PCM
Data Rate
721 Kbps
For Use With
497-6224 - DEMO BOARD FOR GS-BT2416C2.ATI497-6223 - DEMO BOARD FOR GS-BT2416C2.H497-5792 - BOARD DEMO FOR CLASS 1 MODULES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-6845
GS-BT2416C1.H
Features
Applications
May 2008
Bluetooth
Transmission rate up to 721 Kbps
Output power class 1 ( 20 dBm max)
Working distance up to 100 meters
ACL and SCO links
AFH interference resistance
Supports USB (1.1) /UART/PCM (pulse code
modulation)/SPI/ I²C interfaces
Optimized link manager and control
Support wireless LAN coexistence in
collocated scenario
Integrated 4 Mbit Flash, 64 Kbytes RAM,
4 Kbytes ROM
3.3 V single supply voltage
Hardware based UART flow control
Serial cable replacement
Industrial control
Laptops
POS terminals
Data acquisition equipment
Internet access points
Machine control
Sensor monitoring
Robotic and bionic control
Security control
Patient monitoring
Audio gateway applications
Hands-free sets
Wireless printers
Cordless terminals
Laptops, PCs and accessories
Hand held devices and accessories
HID devices (keyboard, mouse, joystick, game
controller...)
®
specification V.1.2 compliant
Bluetooth
®
class 1 module with embedded HCI FW
Rev 2
Description
ST Bluetooth
easy implementation in embedded applications.
Class 1 modules enable wireless communication
with other Bluetooth
100 m away. The GS-BT2416C1.H integrates on
a unique FR4 PCB support: BT 1.2 radio and
baseband, memory, 32 kHz and 13 MHz
oscillator, Vreg as well PA function. The module
embeds customer framework up to HCI level
allowing interoperability with HCI top resident on
Host. The antenna has not been included in order
to grant a degree of freedom to the user in
selecting the most suitable design and placement
between external and integrated antenna that
could be SMA aerial or a low cost antenna trace
designed on PCB. For more details pleas refer to
GS-BT2416C1DB application note. The
GS-BT2416C1.H is the HCI module of the
GS-BT2416C1.xx series. GS-BT2416C1.H is
BQB pre-qualified. Conformance testing through
Bluetooth
time to market after system integration by
ensuring a high degree of compliance and
interoperability.
®
qualification program enables a fast
®
modules are highly integrated for
GS-BT2416C1.H
®
enabled devices up to
www.st.com
1/19
19

Related parts for GS-BT2416C1.H

GS-BT2416C1.H Summary of contents

Page 1

... Class 1 modules enable wireless communication with other Bluetooth 100 m away. The GS-BT2416C1.H integrates on a unique FR4 PCB support: BT 1.2 radio and baseband, memory, 32 kHz and 13 MHz oscillator, Vreg as well PA function. The module ...

Page 2

... Integrate firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5.2 Command interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5.3 Usage scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.1 Antenna reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 8.1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 8.2 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 10 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 11 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2/19 GS-BT2416C1.H ...

Page 3

... GS-BT2416C1.H 1 Certifications ● CE compliant (IMQ Exp. opinion 0081-AREF00017) – Safety EN60950-1 (2001) – EMC EN301 489 17V1.2.1 – Radio ES 300 328 V1.6. – FCC certified on GS-BT2416C1DB (for a more exhaustive explanation, please refer to GS-BT2416C1DB application note) – FCC ID: S9NBT2416C1DB ● BQB compliant ...

Page 4

... DD Operating ambient T stg temperature 4/19 Table 1) indicate limits beyond which damage to the device Table 2) define the limits for functional operation and parametric Parameter Parameter Conditions - 20 °C < T < 70 °C GS-BT2416C1.H Values Unit Min Max 4 V Vss -0.5 Vdd+0 -40 +85 °C 240 ...

Page 5

... GS-BT2416C1.H 3 Electrical characteristics 3.1 DC I/O specification Table 3. DC input / output specification Symbol V Low level input voltage il V High level input voltage ih V Schmitt trigger hysteresis hyst V Low level output voltage ol V High level output voltage oh ® 4 Bluetooth Table 4. Bluetooth Symbol CHs ...

Page 6

... A Parameter Conditions 2.402 GHz 2.441 GHz 2.480 GHz lM- lM-Nl ≥ 3 @BER 0.1 % Parameter Conditions DH1 data packet DH3 data packet DH5 data packet Drift rate GS-BT2416C1.H Min Typ Max Unit 18 20 dBm 18 20 dBm 18 20 dBm - 36 dBm - 44 dBm - 84 dBm ...

Page 7

... GS-BT2416C1.H 5 Integrate firmware The GS-BT2416C1.H includes customer framework up to HCI (host control interface) Figure 1. HCI firmware implementation Serial Interface Layer UART, USB, … SCO channels – Synchronous Connection Oriented Hardware Layer Set up the physical connection 5.1 Features The module with HCI embedded is interoperable with qualified BT stack protocols and suitable for any BT applications ...

Page 8

... Keep the RF ground separate from the module supply voltage ground; the two grounds are already connected inside the module in one point, see below a possible implementation. Figure 2. Module foot print 8/19 RF gnd Module foot print Supply voltage GND GS-BT2416C1.H ...

Page 9

... GS-BT2416C1.H 6.1 Antenna reference RF output pin must be connected to an antenna which could be: ● Antenna directly printed on the pcb ● Integrated antenna as, for example, antenova ANCV12G44SAA127, pulse W3008, Yageo CAN4311153002451K. ● External antenna connected by means a SMA connector Figure 3. Antenna on PCB ● Despite of the type of antenna chosen, the connection between the RF out pin and the antenna must be executed in such a way that the connection trace must be matched to have characteristic impedance (Z0 Ω ...

Page 10

... Block diagram 7 Block diagram Figure 7. Block diagram UART USB PCM SPI I²C GPIO 10/19 32kHz 32kHz XTAL XTAL STLC2416 STLC2150 Baseband Radio chip ARM7 proc GS-BT2416C1.H RF antenna PA SW Filter LNA ...

Page 11

... GS-BT2416C1.H 8 Pin settings 8.1 Pin connections Figure 8. Pin connection diagram Pin settings 11/19 ...

Page 12

... I/O Not to be used internally used for RX/TX switch 15 ---- I/O Not to be used internally used for TX gain setting 16 ---- I/O Not to be used internally used for TX gain setting 17 ---- I/O Not to be used internally used for TX gain setting 18 ---- I/O Not to be used internally used for TX gain setting 12/19 GS-BT2416C1.H Description ...

Page 13

... GS-BT2416C1.H Table 7. Pin descriptions (continued) Pin N° Name I/O Test interface signals 19 TDI --- JTAG pin 20 TDO --- JTAG pin 21 TMS --- JTAG pin 22 NTRST --- JTAG pin 23 TCK --- JTAG pin If not used connect to VSS1 I2C interface signals 24 I2C_dat I/O I2C bus interface data to be connected to VDD with 10 kΩ resistor ...

Page 14

... Time within 5 °C of actual peak temperature (t Ramp down rate Time from 25 °C to peak temperature Figure 9. Soldering 14/ SMAX Preheat min) S max GS-BT2416C1.H PB free assembly 3 °C / sec max 150 °C 200 °C 60 – 100 sec 217 °C 40 – 70 sec 240 + 0 °C 10 – 20 sec 6 °C / sec 8 minutes max ...

Page 15

... GS-BT2416C1.H 10 Mechanical dimensions In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...

Page 16

... Mechanical dimensions Figure 11. Land pattern 16/19 GS-BT2416C1.H ...

Page 17

... GS-BT2416C1.H 11 Ordering information scheme Table 9. Ordering information scheme ® Bluetooth modules V 1.2 compliant Class 1 Embedded HCI Ordering information scheme GS-BT 2416 C1 H 17/19 ...

Page 18

... Revision history 12 Revision history Table 10. Revision history Date 31-Aug-2006 27-May-2008 18/19 Revision 1 First release Updated: Cover page 2 Added: Section 9 on page 14 GS-BT2416C1.H Changes ...

Page 19

... GS-BT2416C1.H Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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