GP1S093HCZ0F Sharp Microelectronics, GP1S093HCZ0F Datasheet - Page 7

SENSOR OPTO SLOT 2MM TRANS THRU

GP1S093HCZ0F

Manufacturer Part Number
GP1S093HCZ0F
Description
SENSOR OPTO SLOT 2MM TRANS THRU
Manufacturer
Sharp Microelectronics
Type
Unamplifiedr
Datasheet

Specifications of GP1S093HCZ0F

Sensing Distance
0.079" (2mm)
Sensing Method
Transmissive
Output Configuration
Phototransistor
Current - Dc Forward (if)
50mA
Current - Collector (ic) (max)
20mA
Voltage - Collector Emitter Breakdown (max)
35V
Response Time
50µs, 50µs
Mounting Type
Through Hole
Package / Case
PCB Mount
Operating Temperature
-25°C ~ 85°C
Output Collector Emitter Voltage (detector)
35 V
Maximum Reverse Voltage (emitter)
6 V
Maximum Collector Current (detector)
20 mA
Slot Width
2 mm
Aperture Width
0.3 mm
Output Device
Phototransistor
Power Dissipation
100 mW
Maximum Fall Time
150000 ns
Maximum Operating Temperature
+ 85 C
Maximum Rise Time
150000 ns
Minimum Operating Temperature
- 25 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
425-1963-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
GP1S093HCZ0F
Manufacturer:
Sharp Microelectronics
Quantity:
1 982
Part Number:
GP1S093HCZ0F
Manufacturer:
Panasonic
Quantity:
2 740
Part Number:
GP1S093HCZ0F
0
■ Manufacturing Guidelines
● Soldering Method
● Cleaning instructions
● Presence of ODC
Flow Soldering:
Hand soldering
Other notice
Solvent cleaning :
Ultrasonic cleaning :
Recommended solvent materials :
Soldering should be completed below 260˚C and within 5 s.
Please solder within one time.
Soldering area is 1mm or more away from the bottom of housing.
Please take care not to let any external force exert on lead pins.
Please don't do soldering with preheating, and please don't do soldering by refl ow.
Hand soldering should be completed within 3 s when the point of solder iron is below 350̊C.
Please solder within one time.
Please don't touch the terminals directly by soldering iron.
Soldered product shall treat at room temperature.
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Do not execute ultrasonic cleaning.
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specifi c brominated fl ame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
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Sheet No.: D3-A00401EN
GP1S093HCZ0F

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