NUS6160MNTWG ON Semiconductor, NUS6160MNTWG Datasheet - Page 13

• Manufacturer Part Number: NUS6160MNTWG
• Description: IC OVP LOW PRO W/MOSFET 22-QFN
• Manufacturer: ON Semiconductor

Specifications of NUS6160MNTWG

• Voltage - Working: 1.2 ~ 20V
• Technology: Mixed Technology
• Number Of Circuits: 1
• Applications: General Purpose
• Package / Case: 22-TQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Voltage - Clamping: -

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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16X
25X
NOTE 4
2X
REFERENCE
G
G
K
2X
0.15
0.10
0.08
DETAIL A
PIN 1
0.15
E3
E2
C
C
C
D3
È È È
È È È
È È È
È È È
C
1
7
BOTTOM VIEW
SIDE VIEW
TOP VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D
DETAIL B
G1
18
A3
G2
D2
D4
12
e
E4
A
B
E
A1
22X
b
EXPOSED Cu
0.10
0.05
22X
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
A
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
L
C
C
C
L1
http://onsemi.com
SEATING
PLANE
QFN22, 3x4, 0.5P
NOTE 3
CASE 485AT−01
A
É É
É É É É
B
ISSUE B
CONSTRUCTIONS
CONSTRUCTIONS
DETAIL B
MOLD CMPD
OPTIONAL
DETAIL A
13
OPTIONAL
*For additional information on our Pb−Free strategy and soldering
L
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A1
É É É
É É É
Ç Ç Ç
4.30
22X
0.52
0.50
PITCH
22X
L
1.47
1.47
SOLDERING FOOTPRINT*
0.30
A3
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
PADS AS WELL AS THE TERMINALS.
DIM
A1
A3
D2
D3
D4
E2
E3
E4
L1
G1
G2 0.855
G
A
b
D
E
e
K
L
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
3.30
MIN
0.80
0.00
0.20
1.45
0.52
1.02
1.05
1.30
1.40
0.25
0.30
1.35
0.95
1.55
−−−
MILLIMETERS
DIMENSIONS: MILLIMETERS
0.39
3.00 BSC
4.00 BSC
0.50 BSC
0.20 REF
0.025
0.325
0.885
NOM
0.90
0.25
1.50
0.57
1.07
1.10
1.35
1.45
1.40
1.05
−−−
−−−
1.14
0.915
MAX
1.00
0.05
0.30
1.55
0.62
1.12
1.15
1.40
1.50
0.35
0.15
1.50
1.15
−−−
0.925
1.21
1.47
PACKAGE
OUTLINE
NUS6160MN/D
1.58