PK30X256VMD100 Freescale Semiconductor, PK30X256VMD100 Datasheet - Page 20

• Manufacturer Part Number: PK30X256VMD100
• Description: IC ARM CORTEX MCU 256K 144-MAP
• Manufacturer: Freescale Semiconductor
• Series: Kinetisr

Specifications of PK30X256VMD100

• Core Processor: ARM Cortex-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SDHC, SPI, UART/USART
• Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
• Number Of I /o: 102
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 37x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 144-LBGA
• Rohs Compliant: Yes
• Processor Series: Kinetis
• Core: ARM Cortex M4
• Data Ram Size: 64 KB
• Interface Type: UART, SPI, I2C, I2S, CAN
• Maximum Clock Frequency: 100 MHz
• Number Of Programmable I/os: 102
• Operating Supply Voltage: 1.71 V to 3.6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Peripheral operating requirements and behaviors
5.3.2 Thermal attributes
1.
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
6.1 Core modules
6.1.1 Debug trace timing specifications
20
Single-
layer (1s)
Four-layer
(2s2p)
Single-
layer (1s)
Four-layer
(2s2p)
—
—
—
1. output pins
2. input pins
Board
Symbol
type
T
cyc
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
• have C
• are configured for fast slew rate (PORTx_PCRn[SRE]=0), and
• are configured for high drive strength (PORTx_PCRn[DSE]=1)
• have their passive filter disabled (PORTx_PCRn[PFE]=0)
R
R
R
R
R
R
Ψ
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
Clock period
Description
L
=30pF loads,
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (200 ft./
min. air speed)
Thermal resistance, junction to ambient (200 ft./
min. air speed)
Thermal resistance, junction to board
Thermal resistance, junction to case
Thermal characterization parameter, junction to
package top outside center (natural convection)
Description
K30 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Table 10. Debug trace operating behaviors
Table continues on the next page...
Preliminary
52
44
43
38
33
11
2
LQFP
144
Frequency dependent
Min.
50
30
41
27
17
10
2
MAPBGA
144
Freescale Semiconductor, Inc.
Max.
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
1
1
1
1
2
3
4
Notes
MHz
Unit