PK40X256VMD100 Freescale Semiconductor, PK40X256VMD100 Datasheet - Page 31

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PK40X256VMD100

Manufacturer Part Number
PK40X256VMD100
Description
IC ARM CORTEX MCU 256K 144-MAP
Manufacturer
Freescale Semiconductor
Series
Kinetisr
Datasheets

Specifications of PK40X256VMD100

Core Processor
ARM Cortex-M4
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SDHC, SPI, UART/USART, USB, USB OTG
Peripherals
DMA, I²S, LCD, LVD, POR, PWM, WDT
Number Of I /o
98
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.71 V ~ 3.6 V
Data Converters
A/D 33x16b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LBGA
Rohs Compliant
YES
Processor Series
Kinetis
Core
ARM Cortex M4
Data Ram Size
64 KB
Interface Type
UART, SPI, I2C, I2S, CAN
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
98
Operating Supply Voltage
1.71 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PK40X256VMD100
Manufacturer:
FSL
Quantity:
28
Part Number:
PK40X256VMD100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
3. Crystal startup time is defined as the time between the oscillator being enabled and the OSCINIT bit in the MCG_S register
6.3.3 32kHz Oscillator Electrical Characteristics
This section describes the module electrical characteristics.
6.3.3.1 32kHz oscillator DC electrical specifications
1. The EXTAL32 and XTAL32 pins should only be connected to required oscillator components and must not be connected to
6.3.3.2 32kHz oscillator frequency specifications
1. Proper PC board layout procedures must be followed to achieve specifications.
6.4 Memories and memory interfaces
6.4.1 Flash (FTFL) electrical specifications
This section describes the electrical characteristics of the FTFL module.
6.4.1.1 Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
Freescale Semiconductor, Inc.
Symbol
Symbol
f
being set.
any other devices.
osc_lo
C
t
V
C
V
start
R
BAT
para
load
pp
F
1
Oscillator crystal
Crystal start-up time
Description
Supply voltage
Internal feedback resistor
Parasitical capacitance of EXTAL32 and XTAL32
Internal load capacitance (programmable)
Peak-to-peak amplitude of oscillation
Description
Table 18. 32kHz oscillator DC electrical specifications
Table 19. 32kHz oscillator frequency specifications
K40 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
Preliminary
Min.
Peripheral operating requirements and behaviors
1.71
Min.
32.768
1000
Typ.
Typ.
100
2.5
0.6
15
Max.
Max.
Unit
kHz
3.6
ms
Notes
Unit
1
pF
pF
V
V
31

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