PK40X256VMD100 Freescale Semiconductor, PK40X256VMD100 Datasheet - Page 32

• Manufacturer Part Number: PK40X256VMD100
• Description: IC ARM CORTEX MCU 256K 144-MAP
• Manufacturer: Freescale Semiconductor
• Series: Kinetisr

Specifications of PK40X256VMD100

• Core Processor: ARM Cortex-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SDHC, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
• Number Of I /o: 98
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 33x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 144-LBGA
• Rohs Compliant: YES
• Processor Series: Kinetis
• Core: ARM Cortex M4
• Data Ram Size: 64 KB
• Interface Type: UART, SPI, I2C, I2S, CAN
• Maximum Clock Frequency: 100 MHz
• Number Of Programmable I/os: 98
• Operating Supply Voltage: 1.71 V to 3.6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Peripheral operating requirements and behaviors
1. Maximum time based on expectations at cycling end-of-life.
6.4.1.2 Flash timing specifications — commands
1. Assumes 25MHz flash clock frequency.
2. Maximum times for erase parameters based on expectations at cycling end-of-life.
32
t
hversblk256k
t
t
t
pgmsec512
t
t
Symbol
Symbol
rd1blk256k
t
ersblk256k
t
t
t
t
t
t
pgmsec1k
pgmsec2k
t
t
rd1sec2k
pgmonce
swapx01
swapx02
swapx04
swapx08
hversscr
t
hvpgm4
pgmchk
t
t
t
t
t
rdonce
t
vfykey
ersscr
rdrsrc
pgm4
rd1all
ersall
Longword Program high-voltage time
Sector Erase high-voltage time
Erase Block high-voltage time for 256 KB
Read 1s Block execution time
Read 1s Section execution time (flash sector)
Program Check execution time
Read Resource execution time
Program Longword execution time
Erase Flash Block execution time
Erase Flash Sector execution time
Program Section execution time
Read 1s All Blocks execution time
Read Once execution time
Program Once execution time
Erase All Blocks execution time
Verify Backdoor Access Key execution time
Swap Control execution time
Description
Description
• 256 KB data flash
• 256 KB data flash
• 512 B flash
• 1 KB flash
• 2 KB flash
• control code 0x01
• control code 0x02
• control code 0x04
• control code 0x08
Table 20. NVM program/erase timing specifications
Table 21. Flash command timing specifications
K40 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
Preliminary
Min.
Min.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Typ.
Typ.
160
160
320
20
20
50
20
50
—
—
—
—
—
—
—
1600
Max.
TBD
Max.
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
100
800
800
100
1.4
2.8
40
35
35
35
35
Freescale Semiconductor, Inc.
Unit
Unit
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
Notes
Notes
1
1
1
1
1
2
2
1
2
1