PC123YA2J00F Sharp Microelectronics, PC123YA2J00F Datasheet

Transistor Output Optocouplers Die shrink version PC123AJ0000F

PC123YA2J00F

Manufacturer Part Number
PC123YA2J00F
Description
Transistor Output Optocouplers Die shrink version PC123AJ0000F
Manufacturer
Sharp Microelectronics
Datasheet

Specifications of PC123YA2J00F

Maximum Fall Time
18 us
Maximum Input Diode Current
50 mA
Maximum Reverse Diode Voltage
6 V
Maximum Rise Time
18 us
Output Device
Transistor
Output Type
DC
Configuration
1
Input Type
DC
Maximum Collector Emitter Voltage
70 V
Maximum Collector Emitter Saturation Voltage
200 mV
Isolation Voltage
5000 Vrms
Current Transfer Ratio
400 %
Maximum Forward Diode Voltage
1.4 V
Maximum Collector Current
50 mA
Maximum Power Dissipation
200 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 30 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
PC123N02J00F
Series
■ Description
coupled to a phototransistor.
spacing option and SMT gullwing lead-form option.
■ Features
1. 4-pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
3. Current transfer ratio (CTR : MIN. 50% at I
4. Several CTR ranks available
5. Reinforced insulation type (Isolation distance : MIN.
6. Long creepage distance type (wide lead-form type
7. High isolation voltage between input and output
8. Lead-free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
PC123N02J00F Series contains an IRED optically
It is packaged in a 4-pin DIP, available in wide-lead
Input-output isolation voltage(rms) is 5kV.
CTR is 50% to 400% at input current of 5mA
ing)
V
0.4mm)
only : MIN. 8mm)
(V
CE
iso
=5V)
(rms) : 5kV)
In the absence of confi rmation by device specifi cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specifi cation sheets before using any SHARP device.
F
=5 mA,
1
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
2. Approved by BSI, BS-EN60065, file No. 7087, BS-
3. Approved by SEMKO, EN60065, EN60950, (as mod-
4. Approved by DEMKO, EN60065, EN60950, (as mod-
5. Approved by NEMKO, EN60065, EN60950, (as mod-
6. Approved by FIMKO, EN60065, EN60950, (as model
7. Recognized by CSA fi le No. CA95323 (as model No.
8. Approved by VDE, DIN EN60747-5-2(
9. Package resin : UL fl ammability grade (94V - 0)
■ Applications
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
4. Over voltage detection
DIP 4pin Reinforced Insulation Type
Photocoupler
fi le No. E64380 (as model No. PC123)
EN60950 fi le No. 7409, (as model No. PC123)
el No. PC123)
el No. PC123)
el No. PC123)
No. PC123)
PC123)
tion), fi le No. 40008087 (as model No. PC123)
tentials and impedances
(
) DIN EN60747-5-2 : successor standard of DIN VDE0884.
PC123N02J00F Series
Sheet No.: D2-A09401EN
© SHARP Corporation
Date Sep. 1. 2006
) (as an op-

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PC123YA2J00F Summary of contents

Page 1

PC123N02J00F Series ■ Description PC123N02J00F Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5kV. CTR is 50% to ...

Page 2

Internal Connection Diagram ■ Outline Dimensions 1. Through-Hole [ex. PC123N02J00F] Rank mark Factory identification mark Anode mark Date code 1 4 PC123 2 3 ±0.3 6.5 ±0.30 7.62 Epoxy resin ±0.10 0.26 θ θ θ ...

Page 3

SMT Gullwing Lead-Form [ex. PC123P02J00F] Rank mark Factory identification mark Anode mark Date code ±0.3 6.5 ±0.30 7.62 Epoxy resin +0.4 +0.4 1.0 1.0 −0.0 −0.0 +0.0 10.0 −0.5 Product ...

Page 4

Date code (2 digit) 1st digit Year of production A.D. Mark A.D. Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...

Page 5

Absolute Maximum Ratings Parameter Symbol Forward current *1 Peak forward current Input Reverse voltage Power dissipation Collector-emitter voltage Emitter-collector voltage Output Collector current Collector power dissipation Total power dissipation *2 Isolation voltage V Operating temperature Storage temperature *2 Soldering ...

Page 6

... Model Line-up Lead Form Through-Hole Package DIN − EN60747-5-2 PC123N02J00F PC123YN2J00F PC123NA2J00F PC123YA2J00F Model No. PC123NB2J00F PC123YB2J00F PC123NC2J00F PC123YC2J00F PC123NS2J00F PC123YS2J00F Lead Form SMT Gullwing Package DIN − EN60747-5-2 PC123P02J00F PC123P12J00F Model No. PC123P22J00F PC123GY2J00F PC123P52J00F PC123HY2J00F PC123P82J00F PC123EY2J00F Please contact a local SHARP sales representative to inquire about production status. ...

Page 7

Fig.1 Forward Current vs. Ambient Temperature −30 Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 250 200 150 100 −30 Ambient temperature T ...

Page 8

Fig.7 Current Transfer Ratio vs. Forward Current 300 250 200 150 100 50 0 0.1 1 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 100 −30 Ambient temperature T Fig.11 ...

Page 9

Fig.13 Test Circuit for Response Time Input V CC Output Output R Input Please refer to the conditions in Fig.12. Fig.15 Collector-emitter Saturation Voltage vs. Forward Current 5 I =0.5mA C 1mA 4.5 3mA ...

Page 10

Design Considerations ● Design guide While operating at I <1mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...

Page 11

Manufacturing Guidelines ● Soldering Method Refl ow Soldering : Refl ow soldering should follow the temperature profi le shown below. Soldering should not exceed the curve of temperature profi le and time. Please don't solder more than twice. (˚C) ...

Page 12

Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, ...

Page 13

Package specifi cation ● Sleeve package 1. Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and ...

Page 14

Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A 16.0 ±0.3 H 10.4 ±0.1 0.40 Reel structure ...

Page 15

Wide SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 24.0 H ±0.1 12.4 0.40 Reel structure and Dimensions e d ...

Page 16

Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...

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