MPC8536EAVTAVL Freescale Semiconductor, MPC8536EAVTAVL Datasheet - Page 114

Microprocessors (MPU) PQ38S 8536 SQUID

MPC8536EAVTAVL

Manufacturer Part Number
MPC8536EAVTAVL
Description
Microprocessors (MPU) PQ38S 8536 SQUID
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8536EAVTAVL

Processor Series
MPC85xx
Core
e500
Data Bus Width
32 bit
Maximum Clock Frequency
1500 MHz
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 90 C
Mounting Style
SMD/SMT
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
0 C
Package / Case
FCPBGA-783
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8536EAVTAVLA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Pin States in Deep Sleep State
Figure 75
The AV
the power supplied to the PLL is filtered using a circuit similar to the one shown in following
effectiveness, the filter circuit is placed as closely as possible to the AV
as possible. The ground connection should be near the AV
followed by the 1-µF capacitor, and finally the 1 ohm resistor to the board supply plane. The capacitors are connected from
AV
should be kept short, wide and direct.
Note the following:
3.3
In all low power mode by default, all input and output pads remain driven as per normal functional operation. The inputs remain
enabled.
The exception is that in Deep Sleep mode, GCR[DEEPSLEEP_Z] can be used to tristate a subset of output pads, and disable
the receivers of input pads as defined in
for details.
3.4
Due to large address and data buses, and high operating frequencies, the device can generate transient power surges and high
frequency noise in its power supply, especially while driving large capacitive loads. This noise must be prevented from reaching
other components in the MPC8535E system, and the device itself requires a clean, tightly regulated source of power. Therefore,
it is recommended that the system designer place at least one decoupling capacitor at each V
and LV
GV
must be placed directly under the device using a standard escape pattern as much as possible. If some caps are to be placed
surrounding the part it should be routed with short and large trace to minimize the inductance.
114
DD
DD
_SRDSn to the ground plane. Use ceramic chip capacitors with the highest possible self-resonant frequency. All traces
, and LV
DD
DD
AV
Signals on the SerDes interface are fed from the XV
shows the PLL power supply filter Circuit.
_SRDSn signals provides power for the analog portions of the SerDes PLL. To ensure stability of the internal clock,
pin of the device. These decoupling capacitors should receive their power from separate V
Pin States in Deep Sleep State
Decoupling Recommendations
DD
DD
should be a filtered version of SV
, and GND power planes in the PCB, utilizing short low impedance traces to minimize inductance. Capacitors
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 3
SnV
V
DD
DD
1. An 0805 sized capacitor is recommended for system initial bring-up
Figure 75. MPC8535E PLL Power Supply Filter Circuit
Figure 76. SerDes PLL Power Supply Filter Circuit
10 Ω
1.0 Ω
Table
1. See the MPC8536E PowerQUICC III Integrated Processor Reference Manual
2.2 µF
DD
2.2 µF
.
DD
1
GND
_SRDSn balls. The 0.003-µF capacitor is closest to the balls,
DD
GND
power plane.
Low ESL Surface Mount Capacitors
2.2 µF
2.2 µF
DD
_SRDSn balls to ensure it filters out as much noise
1
AV
0.003 µF
DD
DD
AV
Figure
, TV
DD -
DD
DD,
SRDS
Freescale Semiconductor
76. For maximum
, BV
TV
DD
DD
, OV
, BV
DD
DD
, GV
, OV
DD
DD
,
,

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