A-12W-K Fujitsu, A-12W-K Datasheet - Page 7

• Manufacturer Part Number: A-12W-K
• Description: Low Signal Relays - PCB Mini Signal 12VDC
• Manufacturer: Fujitsu

Specifications of A-12W-K

• Contact Form: 2 Form C (DPDT)
• Coil Voltage: 12 VDC
• Coil Type: Non-Latching
• Power Consumption: 140 mW
• Termination Style: PCB Pins
• Maximum Switching Current: 2 A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Reflow Solder condtion
3. Moisture Sensitivity
4. Tin Whisker
5. Solid State Relays
is between the terminal and the Sn plating to avoid whisker.
1. General Information
We will ship leaded relays as long as the leaded relay inventory exists.
2. Recommended Lead Free Solder Profile
RoHS Compliance and Lead Free Relay Information
Moisture Sensitivity Level standard is not applicable to electromechanical realys.
SnAgCu solder is known as low riskof tin whisker. No considerable length whisker was found by our in-house
Each lead terminal will be changed from solder plating to Sn plating and Nickel plating. A layer of Nickel plating
(http://www.fcai.fujitsu.com/pdf/LeadFreeLetter.pdf)
Most signal and some power relays also comply with RoHS. Please refer to individual data
sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials that
are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE).
“LF” is marked on each outer and inner carton. (No marking on individual relays).
To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.
Relays produced after the specific date code that is indicated on each data sheet are lead-free
now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward
Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays.
It has been verified that using lead-free relays in leaded assembly process will not cause any
problems (compatible).
Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February 2005)
test.
We highly recommend that you confirm your actual solder conditions
Flow Solder condtion:
Pre-heating:
Soldering:
Solder by Soldering Iron:
Soldering Iron
Temperature:
Duration:
A SERIES
maximum 120˚C
dip within 5 sec. at
260˚C soler bath
maximum 3 sec.
maximum 360˚C
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