GCM1885G1H150JA16D Murata Electronics North America, GCM1885G1H150JA16D Datasheet - Page 59

• Manufacturer Part Number: GCM1885G1H150JA16D
• Description: CAP CER 15PF 50V X8G SMD
• Manufacturer: Murata Electronics North America
• Series: GCMr

Specifications of GCM1885G1H150JA16D

• Voltage - Rated: 50V
• Lead Style: *
• Capacitance: 15pF
• Tolerance: ±5%
• Temperature Coefficient: X8G
• Mounting Type: *
• Operating Temperature: -55°C ~ 150°C
• Applications: Automotive
• Ratings: AEC-Q200
• Package / Case: *
• Size / Dimension: *
• Thickness: *
• Lead Spacing: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Vibration and Impact
2. Circuit Board Material
3. Land Layout for Cropping PC Board
<Examples to be avoided>
[Component Direction]
Solder and Mounting
Do not expose a capacitor to excessive shock or vibration
during use.
In case that ceramic chip capacitor is soldered on the
metal board, such as Aluminum board, the stress of heat
expansion and contraction might cause the crack of
ceramic capacitor, due to the difference of thermal
expansion coefficient between metal board and ceramic
chip.
Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
<Examples of improvements>
Locate chip
horizontal to the
direction in which
stress acts.
[Chip Mounting Close to Board Separation Point]
Perforation
A
Slit
B
D
C
Continued on the following page.
Chip arrangement
Worst AGCGB~D Best
!Caution
C03E.pdf
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