GCM1885G1H150JA16D Murata Electronics North America, GCM1885G1H150JA16D Datasheet - Page 64

• Manufacturer Part Number: GCM1885G1H150JA16D
• Description: CAP CER 15PF 50V X8G SMD
• Manufacturer: Murata Electronics North America
• Series: GCMr

Specifications of GCM1885G1H150JA16D

• Voltage - Rated: 50V
• Lead Style: *
• Capacitance: 15pF
• Tolerance: ±5%
• Temperature Coefficient: X8G
• Mounting Type: *
• Operating Temperature: -55°C ~ 150°C
• Applications: Automotive
• Ratings: AEC-Q200
• Package / Case: *
• Size / Dimension: *
• Thickness: *
• Lead Spacing: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

3
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
2. Mounting of Chips
3. Soldering
(1) Limit of losing effective area of the terminations and
(2) Flux Application
62
Notice
An excessive amount of flux generates a large quantity of
Flux containing too high percentage of halide may cause
Do not use strong acidic flux.
Do not use water-soluble flux*.
(*Water-soluble flux can be defined as non rosin type flux
Thickness of adhesives applied
Keep thickness of adhesives applied (50-105 m or more)
to reinforce the adhesive contact considering the
thickness of the termination or capacitor (20-70 m) and
the land pattern (30-35 m).
Mechanical shock of the chip placer
When the positioning claws and pick-up nozzle are worn,
the load is applied to the chip while positioning is
concentrated in one position, thus causing cracks,
breakage, faulty positioning accuracy, etc.
Careful checking and maintenance are necessary to
prevent unexpected trouble.
An excessively low bottom dead point of the suction
nozzle imposes great force on the chip during mounting,
causing cracked chips. Please set the suction nozzle's
bottom dead point on the upper surface of the board.
conditions needed for soldering.
flux gas, causing deteriorated solderability.
So apply flux thinly and evenly throughout.
(A foaming system is generally used for flow soldering.)
corrosion of the outer electrodes unless sufficient
cleaning. Use flux with a halide content of 0.2% max.
including wash-type flux and non-wash-type flux.)
Continued from the preceding page.
Depending on the conditions of the soldering
temperature and/or immersion (melting time),
effective areas may be lost in some part of the
terminations.
To prevent this, be careful in soldering so that any
possible loss of the effective area on the terminations
will securely remain at a maximum of 25% on all
edge length A-B-C-D-A of part with A, B, C, D, shown
in the Figure below.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
B
C
A
D
Termination
(3) Solder
The use of Sn-Zn based solder will deteriorate the
reliability of the MLCC.
Please contact our sales representative or product
engineers on the use of Sn-Zn based solder in advance.
Continued on the following page.
C03E.pdf
10.5.20