STM32F101VCT6TR STMicroelectronics, STM32F101VCT6TR Datasheet - Page 8

• Manufacturer Part Number: STM32F101VCT6TR
• Description: MCU ARM 32BIT 256KB FLSH 100LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F101VCT6TR

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 36MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 80
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LFQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

List of figures
Figure 41.
Figure 42.
Figure 43.
Figure 44.
Figure 45.
Figure 46.
Figure 47.
Figure 48.
Figure 49.
Figure 50.
Figure 51.
Figure 52.
Figure 53.
Figure 54.
Figure 55.
Figure 56.
Figure 57.
Figure 58.
8/106
I
SPI timing diagram - slave mode and CPHA=0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
SPI timing diagram - slave mode and CPHA=1
SPI timing diagram - master mode
ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Power supply and reference decoupling (V
Power supply and reference decoupling (VREF+ connected to VDDA) . . . . . . . . . . . . . . . 91
12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Recommended PCB design rules (0.80/0.75 mm pitch BGA) . . . . . . . . . . . . . . . . . . . . . . 94
LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
LQFP144, 20 x 20 mm, 144-pin thin quad flat
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Recommended footprint
LQFP100 – 14 x 14 mm, 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 97
Recommended footprint
LQFP64 – 10 x 10 mm, 64 pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . 98
Recommended footprint
LQFP64 P
2
C bus AC waveforms and measurement circuit
D
max vs. T
A
(1)
(1)
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Doc ID 14610 Rev 7
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
REF+
STM32F101xC, STM32F101xD, STM32F101xE
(1)
not connected to V
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
DDA
). . . . . . . . . . . . . . 90