STM32F101VCT6TR STMicroelectronics, STM32F101VCT6TR Datasheet - Page 8

MCU ARM 32BIT 256KB FLSH 100LQFP

STM32F101VCT6TR

Manufacturer Part Number
STM32F101VCT6TR
Description
MCU ARM 32BIT 256KB FLSH 100LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101VCT6TR

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
80
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

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Quantity
Price
Part Number:
STM32F101VCT6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F101VCT6TR
Manufacturer:
ST
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Part Number:
STM32F101VCT6TR
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List of figures
Figure 41.
Figure 42.
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Figure 49.
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Figure 58.
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I
SPI timing diagram - slave mode and CPHA=0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
SPI timing diagram - slave mode and CPHA=1
SPI timing diagram - master mode
ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Power supply and reference decoupling (V
Power supply and reference decoupling (VREF+ connected to VDDA) . . . . . . . . . . . . . . . 91
12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Recommended PCB design rules (0.80/0.75 mm pitch BGA) . . . . . . . . . . . . . . . . . . . . . . 94
LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
LQFP144, 20 x 20 mm, 144-pin thin quad flat
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Recommended footprint
LQFP100 – 14 x 14 mm, 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 97
Recommended footprint
LQFP64 – 10 x 10 mm, 64 pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . 98
Recommended footprint
LQFP64 P
2
C bus AC waveforms and measurement circuit
D
max vs. T
A
(1)
(1)
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Doc ID 14610 Rev 7
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
REF+
STM32F101xC, STM32F101xD, STM32F101xE
(1)
not connected to V
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
DDA
). . . . . . . . . . . . . . 90

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