W25Q64CVSSIG Winbond Electronics, W25Q64CVSSIG Datasheet - Page 7

• Manufacturer Part Number: W25Q64CVSSIG
• Description: IC SPI FLASH 64MBIT 8-SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q64CVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 64M (8M x 8)
• Speed: 80MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.083", 2.10mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: Q5822008

*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
5. PAD CONFIGURATION PDIP 300-MIL
6. PIN DESCRIPTION SOIC 208-MIL, WSON 6X5/8X6-MM AND PDIP 300-MIL
PIN NO.
1
2
3
4
5
6
7
8
/HOLD (IO3)
PIN NAME
/WP (IO2)
DO (IO1)
DI (IO0)
GND
VCC
CLK
/CS
Figure 1c. W25Q64CV Pin Assignments, 8-pin PDIP (Package Code DA)
I/O
I/O
I/O
I/O
I/O
I
I
Chip Select Input
Data Output (Data Input Output 1)*
Write Protect Input ( Data Input Output 2)*
Ground
Data Input (Data Input Output 0)*
Serial Clock Input
Hold Input (Data Input Output 3)*
Power Supply
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Publication Release Date: January 4, 2010
FUNCTION
2
1
1
Preliminary - Revision B
2
W25Q64CV