W25Q64CVSSIG Winbond Electronics, W25Q64CVSSIG Datasheet - Page 71

• Manufacturer Part Number: W25Q64CVSSIG
• Description: IC SPI FLASH 64MBIT 8-SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q64CVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 64M (8M x 8)
• Speed: 80MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.083", 2.10mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: Q5822008

13.5 16-Pin SOIC 300-mil (Package Code SF)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
SYMBOL
A1
A2
E1
E
D
A
b
C
E
y
θ
L
2
10.08
10.01
MIN
2.36
0.10
0.33
0.18
7.39
0.38
0°
-
-
MILLIMETERS
1.27 BSC
NOM
10.31
10.31
2.49
2.31
0.41
0.23
7.49
0.81
-
-
-
- 71 -
10.49
10.64
0.076
MAX
2.64
0.30
0.51
0.28
7.59
1.27
8°
-
0.093
0.004
0.013
0.007
0.397
0.394
0.291
0.015
MIN
0°
-
-
Publication Release Date: January 4, 2010
INCHES
0.50 BSC
NOM
0.098
0.091
0.016
0.009
0.406
0.406
0.295
0.032
-
-
-
MAX
0.104
0.012
0.020
0.011
0.413
0.419
0.299
0.050
0.003
8°
-
Preliminary - Revision B
W25Q64CV