BGU7033,115 NXP Semiconductors, BGU7033,115 Datasheet

IC AMPLIFIER MMIC LNA SOT363

BGU7033,115

Manufacturer Part Number
BGU7033,115
Description
IC AMPLIFIER MMIC LNA SOT363
Manufacturer
NXP Semiconductors
Type
Monolithic Microwave Integrated Circuit (MMIC)r
Datasheet

Specifications of BGU7033,115

Current - Supply
43mA
Frequency
40MHz ~ 1GHz
Gain
10dB
Noise Figure
6dB
P1db
14dBm
Package / Case
6-TSSOP, SC-88, SOT-363
Rf Type
General Purpose
Test Frequency
1GHz
Voltage - Supply
4.75 V ~ 5.5 V
Operating Frequency
1 GHz
Operating Supply Voltage
24 V
Supply Current
43 mA
Maximum Power Dissipation
250 mW
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 10 C
Number Of Channels
1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-5508-2
1. Product profile
CAUTION
1.1 General description
1.2 Features and benefits
1.3 Applications
The BGU7033 MMIC is a wideband amplifier with selectable gain and bypass mode. It is
designed specifically for high linearity, low noise applications over a frequency range of
40 MHz to 1 GHz. It is especially suited to Set-Top Box applications.
The LNA is housed in a 6-pin SOT363 plastic SMD package.
BGU7033
1 GHz wideband low-noise amplifier with bypass
Rev. 2 — 13 September 2010
Internally biased
Programmable gain and bypass modes: G
Flat gain between 40 MHz and 1 GHz
Noise figure of 4.5 dB
High linearity with an IP3
75 Ω input and output impedance
Power-down during bypass mode
Bypass mode current consumption < 5 mA
ESD protection > 2 kV Human Body Model (HBM) on all pins
Terrestrial and cable Set-Top Boxes (STB)
Silicon and “Can” tuners
Personal and Digital Video Recorders (PVR and DVR)
Home networking and in-house signal distribution
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
O
of 29 dBm
p
= 10 dB, G
p
= 5 dB and bypass
Product data sheet

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BGU7033,115 Summary of contents

Page 1

BGU7033 1 GHz wideband low-noise amplifier with bypass Rev. 2 — 13 September 2010 1. Product profile 1.1 General description The BGU7033 MMIC is a wideband amplifier with selectable gain and bypass mode designed specifically for high linearity, ...

Page 2

... NXP Semiconductors 1.4 Quick reference data Table amb Symbol Parameter CC(tot) T amb NF P L(1dB) IP3 O [1] Mode depends on setting of V [2] The fundamental frequency ( Pinning information Table 2. Pin Ordering information Table 3. Type number BGU7033 4. Marking Table 4. Type number BGU7033 Note: % character indicates the location of production. ...

Page 3

... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ctrl(Gp) V ctrl(bp) I CC(tot) P tot stg amb V ESD [1] V ctrl(Gp) [2] V ctrl(bp) [ the temperature at the solder point of the ground lead. sp Remark: V Remark Thermal characteristics Table 6. Symbol ...

Page 4

... NXP Semiconductors Table amb Symbol Parameter out P L(1dB) IP3 O [1] Mode depends on setting of V [2] The fundamental frequency ( Table 8. − ° ≤ CTRL1 ≤ 0.7 ≥ 4.3 ≤ 0.7 ≥ 4.3 Remark: V Remark: V BGU7033 Product data sheet Characteristics …continued ° C; typical values ...

Page 5

... NXP Semiconductors 8. Application information Other applications are possible. Please contact your local sales representative for more information. Application notes are available on the NXP website. 8.1 Application circuit Fig 1. All control and supply lines must be decoupled properly. The decoupling capacitors must be placed as close to the device as possible. ...

Page 6

... NXP Semiconductors 8.2 Application circuit board layout RF_IN Fig 2. Table 9. See Figure 1 Component C1, C2 C3, C4 R2, R3 X1, X2 [1] L1 and R1 must have a power rating of 0 higher. BGU7033 Product data sheet 1 GHz wideband low-noise amplifier with bypass PCB material = FR4. PCB thickness = 1.6 mm. ...

Page 7

... NXP Semiconductors 9. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 0.30 1.1 0.25 mm 0.1 0.20 0.8 0.10 OUTLINE VERSION IEC SOT363 Fig 3. Package outline SOT363 BGU7033 Product data sheet scale 2.2 1.35 2.2 1 ...

Page 8

... NXP Semiconductors 10. Abbreviations Table 10. Acronym AC DC LNA MMIC PCB RF SMD 11. Revision history Table 11. Revision history Document ID Release date BGU7033 v.2 20100913 • Modifications: The status of this data sheet has been changed to Product data sheet. BGU7033 v.1 20100816 BGU7033 Product data sheet ...

Page 9

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 10

... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

Page 11

... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Application information 8.1 Application circuit . . . . . . . . . . . . . . . . . . . . . . . 5 8.2 Application circuit board layout . . . . . . . . . . . . . 6 9 Package outline ...

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