BGA2002,115 NXP Semiconductors, BGA2002,115 Datasheet
BGA2002,115
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BGA2002,115 Summary of contents
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BGA2002 MMIC amplifier Rev. 4 — 9 February 2011 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) amplifier consisting of an NPN double polysilicon transistor with integrated biasing for low voltage applications in a plastic, 4-pin ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number BGA2002 4. Marking Table 4. Type number BGA2002 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot T stg T j BGA2002 Product data sheet Pinning Description GND ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-sp) 7. Characteristics Table 7. Characteristics bias bias amb Symbol Parameter I supply current CC MSG maximum stable gain |S21| 2 insertion power gain P output power gain compression I L(1dB) NF noise figure IP3 input third-order intercept point I 100 GND bias ...
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... NXP Semiconductors 12 I bias (mA − ( bias ( 1.5 V bias ( bias ( 2.5 V bias ( bias ( 3.5 V bias ( bias ( 4.5 V bias Fig 3. Bias current as a function of ambient temperature; typical values 30 gain (dB MSG 900 MHz. Fig 5. Gain as a function of bias current; typical values BGA2002 Product data sheet ...
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... NXP Semiconductors 40 gain (dB MSG mA. bias bias Fig 7. Gain as a function of frequency; typical values BGA2002 Product data sheet 001aam925 3 NF min (dB max (MHz) ( 2400 MHz ( 1000 MHz ( 900 MHz ( 1800 MHz Fig 8. All information provided in this document is subject to legal disclaimers. Rev. 4 — 9 February 2011 ...
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... NXP Semiconductors 180° 900 MHz 2 bias ( ( ( ( 1 1 1.7 dB Fig 9. Noise, stability and gain circles; typical values BGA2002 Product data sheet 90° unstable region +1 source 135° +0.5 +0.2 (1) (2) 0 0.2 0.5 1 (3) −0.2 −0.5 −135° −1 −90° ...
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... NXP Semiconductors 180° 1800 MHz 2 bias ( ( ( ( 1 1 1.7 dB Fig 10. Noise, stability and gain circles; typical values BGA2002 Product data sheet 90° unstable region +1 source 135° +0.5 (1) +0.2 Γopt (2) (3) (4) 0 0.2 0.5 1 (5) (6) −0.2 −0.5 −135° −1 − ...
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... NXP Semiconductors 180° 2 mA; Z bias bias Fig 11. Common emitter input reflection coefficient (S 180° 2 mA; Z bias bias Fig 12. Common emitter forward transmission coefficient (S BGA2002 Product data sheet 90° +1 135° +0.5 +0.2 0 0.2 0 GHz −0.2 1.8 GHz 1 GHz −0.5 −135° ...
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... NXP Semiconductors 180° 2 mA; Z bias bias Fig 13. Common emitter reverse transmission coefficient (S 180° 2 mA; Z bias bias Fig 14. Common emitter output reflection coefficient (S BGA2002 Product data sheet 90° 135° 3 GHz 0.5 0.4 0.3 0.2 0.1 100 MHz −135° ...
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... NXP Semiconductors 8. Test information 8.1 Quality information All qualification tests are performed according AEC-Q100 except for read point testing, this is done only at room temperature. BGA2002 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 9 February 2011 BGA2002 MMIC amplifier © ...
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... NXP Semiconductors 9. Package outline Plastic surface-mounted package; reverse pinning; 4 leads DIMENSIONS (mm are the original dimensions UNIT max 0.4 0.7 1.1 mm 0.1 0.8 0.3 0.5 OUTLINE VERSION IEC SOT343R Fig 15. Package outline SOT343R BGA2002 Product data sheet scale 0.25 2.2 1.35 1.3 1 ...
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... Modifications: Status changed from objective to product. • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. BGA2002 v.2 19980901 BGA2002 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any 13. Contact information For more information, please visit: ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . 10 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 10 Abbreviations ...