BLM6G22-30,118 NXP Semiconductors, BLM6G22-30,118 Datasheet - Page 9

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BLM6G22-30,118

Manufacturer Part Number
BLM6G22-30,118
Description
TRANS SOT834-1
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BLM6G22-30,118

Frequency
2.11GHz ~ 2.17GHz
Gain
30dB
Package / Case
SOT834-1
Rf Type
W-CDMA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NXP Semiconductors
Fig 12. Package outline SOT822-1 (HSOP16)
BLM6G22-30_BLM6G22-30G
Product data sheet
HSOP16: plastic, heatsink small outline package; 16 leads
Dimensions
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included
mm
Unit
SOT822-1
Outline
version
(1)
max
nom
min
w
3.6
A
Z
y
1
16
pin 1 index
0.2
A
0
1
e
2
3.5
3.2
A
e
IEC
2
(4×)
(6×)
0.35
b
A
p2
3
D
D
1
−0.06
e
0.06
1
A
e
3
4
(2×)
(2×)
b
p
0.43
0.28
b
JEDEC
(10×)
p
All information provided in this document is subject to legal disclaimers.
b
1.09
0.94
b
p1
p1
12
References
w
(5×)
11
0
5.87
5.72
b
D
Rev. 4 — 7 March 2011
p2
2
w
0.32
0.23
BLM6G22-30; BLM6G22-30G
c
E
1
JEITA
D
16.0
15.8
scale
(1)
5
A
2
13.0
12.6
D
1
A
1
W-CDMA 2100 MHz to 2200 MHz power MMIC
1.1
0.9
D
A
2
4
10 mm
11.1
10.9
E
(1)
6.2
5.8
E
1
E
H
E
2
E
2.9
2.5
E
2
detail X
European
projection
1.02 1.37
1.5
1.4
Q
e
0.25
e
v
1
0.25
5.69
e
w
A
L
Q
2
p
© NXP B.V. 2011. All rights reserved.
3.81
0.1
X
e
y
3
Issue date
07-02-08
10-10-20
v
θ
14.5
13.9
2.5
2.0
H
sot822-1_po
Z
(A
E
SOT822-1
A
3
)
1.1
0.8
L
8
0
θ
A
p
9 of 14
°
°

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