AIS326DQ STMicroelectronics, AIS326DQ Datasheet
AIS326DQ
Specifications of AIS326DQ
Available stocks
Related parts for AIS326DQ
AIS326DQ Summary of contents
Page 1
... CMOS process that allows high level of integration to design a dedicated circuit which is factory trimmed to better match the sensing element characteristics. The AIS326DQ has a user selectable full scale of ±2 g, ±6 g and it is capable of measuring acceleration over a bandwidth of 640 Hz for all axes. The device bandwidth may be selected accordingly to the application requirements ...
Page 2
... Digital interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.1 SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.1.1 5.1.2 5.1.3 6 Register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.1 WHO_AM_I (0Fh 7.2 OFFSET_X (16h 2/51 SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Self test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 SPI Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 SPI Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SPI Read in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Doc ID 14956 Rev 4 AIS326DQ ...
Page 3
... AIS326DQ 7.3 OFFSET_Y (17h 7.4 OFFSET_Z (18h 7.5 GAIN_X (19h 7.6 GAIN_Y (1Ah 7.7 GAIN_Z (1Bh 7.8 CTRL_REG1 (20h 7.9 CTRL_REG2 (21h 7.10 CTRL_REG3 (22h 7.11 HP_FILTER_RESET (23h 7.12 STATUS_REG (27h 7.13 OUTX_L (28h 7.14 OUTX_H (29h 7.15 OUTY_L (2Ah 7.16 OUTY_H (2Bh) ...
Page 4
... Electrical characteristics at 105 ° Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 9.1 General guidelines about soldering surface mount accelerometer . . . . . 46 9.2 PCB design guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 9.2.1 9.3 Stencil design and solder paste application . . . . . . . . . . . . . . . . . . . . . . . 47 9.4 Process consideration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 10 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 4/51 PCB design rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Doc ID 14956 Rev 4 AIS326DQ ...
Page 5
... AIS326DQ List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 3. Mechanical characteristics @ Vdd = 3 -40 °C to 105 °C unless otherwise noted Table 4. Electrical characteristics @ Vdd=3 -40 °C to 105 °C unless otherwise noted . . . . 9 Table 5. SPI slave timing values Table 6. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 7. Serial interface pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 8 ...
Page 6
... Table 56. DD_SRC register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Table 57. DD_THSI_L register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 58. DD_THSI_L register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 59. DD_THSI_H register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 60. DD_THSI_H register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 61. DD_THSE_L register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 62. DD_THSE_L register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 63. DD_THSE_H register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 64. DD_THSE_H register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Table 65. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 6/51 Doc ID 14956 Rev 4 AIS326DQ ...
Page 7
... AIS326DQ List of figures Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3. SPI slave timing diagram ( Figure 4. AIS326DQ electrical connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 5. Read and write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 6. SPI read protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 7. Multiple bytes SPI read protocol (2 bytes example Figure 8. SPI Write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 9. Multiple bytes SPI write protocol (2 bytes example Figure 10 ...
Page 8
... GND Vdd Reserved GND X RDY/INT NC Doc ID 14956 Rev 4 Reconstruction Σ∆ Filter Reconstruction Regs Σ∆ SPI Array Filter Reconstruction Σ∆ Filter CONTROL LOGIC & CLOCK INTERRUPT GEN Reserved Vdd AIS326DQ Reserved (TOP VIEW) GND AIS326DQ CS SPC SDO/SDI SDO RDY/INT ...
Page 9
... AIS326DQ Table 2. Pin description Pin 14 Name NC Internally not connected GND 0 V supply Vdd Power supply Reserved Either leave unconnected or connect to GND GND 0 V supply RDY/INT Data ready/inertial wake-up and free-fall interrupt NC Internally not connected SDO SPI serial data output SDI/ SPI serial data input (SDI) ...
Page 10
... Full-scale = ±6 g (4) Z axis Max delta from 25 °C Best fit straight line X, Y axis Full-scale = ±2 g ODR = 40 Hz Best fit straight line Z axis Full-scale = ±2 g ODR = 40 Hz Doc ID 14956 Rev 4 AIS326DQ (2) Min. Typ. Max. Unit ±1.7 ±2.0 ±5.3 ±6.0 1.0 2 ...
Page 11
... AIS326DQ Table 3. Mechanical characteristics @ Vdd = 3 -40 °C to 105 °C unless otherwise (1) noted (continued) Symbol Parameter V Self-test output change st (9) BW System bandwidth T Operating temperature range OP Wh Product weight 1. The product is factory calibrated at 3.3 V. Operation over 3 not recommended 2. Typical specifications are not guaranteed 3 ...
Page 12
... Time to obtain valid data after exiting power-down mode 12/51 Test conditions (3) Vdd = 3.3 V (3) 0.8*Vdd_IO (3) (3) 0.9*Vdd_IO (3) Dec factor = 512 Dec factor = 128 Dec factor = 32 Dec factor = 8 Doc ID 14956 Rev 4 AIS326DQ (2) Min. Typ. Max. 3.0 3.3 3.6 1.71 Vdd 0.67 0. 0.2*Vdd_IO 0.1*Vdd_IO ...
Page 13
... AIS326DQ 2.3 Communication interface characteristics 2.3.1 SPI - serial peripheral interface Subject to general operating conditions for Vdd and T Table 5. SPI slave timing values Symbol tc(SPC) fc(SPC) tsu(CS) th(CS) tsu(SI) th(SI) tv(SO) th(SO) tdis(SO) 1. Values are guaranteed at 8 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not tested in production Figure 3 ...
Page 14
... This is a mechanical shock sensitive device, improper handling can cause permanent damages to the part. This is an ESD sensitive device, improper handling can cause permanent damages to the part. 14/51 Ratings (1) (1) (1) Doc ID 14956 Rev 4 AIS326DQ Maximum value Unit -0.3 to 6.0 V -0.3 to Vdd +0.1 V -0.3 to Vdd_IO +0.3 V 3000 g for 0.5 ms 10000 g for 0 ...
Page 15
... AIS326DQ 2.5 Terminology 2.5.1 Sensitivity Sensitivity describes the gain of the sensor and can be determined e.g. by applying 1 g acceleration to it. As the sensor can measure DC accelerations this can be done easily by pointing the axis of interest towards the center of the earth, noting the output value, rotating the sensor by 180 degrees (point to the sky) and noting the output value again. By doing so, ± ...
Page 16
... The acceleration data may be accessed through an SPI interface thus making the device particularly suitable for direct interfacing with a microcontroller. The AIS326DQ features a data-ready signal (RDY) which indicates when a new set of measured acceleration data is available thus simplifying data synchronization in digital system employing the device itself. ...
Page 17
... AIS326DQ 3.3 Factory calibration The IC interface is factory calibrated for sensitivity (So) and Zero-g level (Off). The trimming values are stored inside the device by a non volatile structure. Any time the device is turned on, the trimming parameters are downloaded into the registers to be employed during the normal operation. This allows the user to employ the device without further calibration ...
Page 18
... The functionality of the device and the measured acceleration data is selectable and accessible through the SPI interface. The design of the application board should take in consideration that the AIS326DQ is equipped also with an I2C compatible interface that it is activated when the signal on CS pin is high (logic:1). ...
Page 19
... LIS3LV02DQ datasheet or contact ST technical support. 5.1 SPI bus interface The AIS326DQ SPI is a bus slave. The SPI allows to write and read the registers of the device. The serial interface interacts with the outside world with 4 wires: CS, SPC, SDI and SDO. Figure 5. ...
Page 20
... DO(7:0) (read mode). This is the data that will be read from the device (MSb first). bit 16-... : data DO(...-8). Further data in multiple byte reading. 20/ AD5 AD4 AD3 AD2 AD1 AD0 DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 Doc ID 14956 Rev 4 AIS326DQ ...
Page 21
... AIS326DQ Figure 7. Multiple bytes SPI read protocol (2 bytes example) CS SPC SDI RW MS SDO 5.1.2 SPI Write Figure 8. SPI Write protocol CS SPC SDI The SPI Write command is performed with 16 clock pulses. Multiple byte write command is performed adding blocks of 8 clock pulses at the previous one. ...
Page 22
... DO(7:0) (read mode). This is the data that will be read from the device (MSb first). Multiple read command is also available in 3-wires mode. 22/51 DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 RW MS AD5 AD4 AD3 AD2 AD1 AD0 Doc ID 14956 Rev 4 AIS326DQ ...
Page 23
... AIS326DQ 6 Register mapping The table given below provides a listing of the 8 bit registers embedded in the device and the related address. Table 8. Registers address map Register name WHO_AM_I OFFSET_X OFFSET_Y OFFSET_Z GAIN_X GAIN_Y GAIN_Z CTRL_REG1 CTRL_REG2 CTRL_REG3 HP_FILTER RESET r STATUS_REG OUTX_L OUTX_H OUTY_L ...
Page 24
... Doc ID 14956 Rev 4 AIS326DQ Default Comment 00000000 00000000 Not used 00000000 00000000 dummy Dummy register Not used 00000000 00000000 00000000 00000000 Reserved ...
Page 25
... WHO_AM_I (0Fh) Table 9. Register W7 W6 Table 10. Register description W7, W0 AIS326DQ physical address equal to 3Ah Addressing this register the physical address of the device is returned. For AIS326DQ the physical address assigned in factory is 3Ah. 7.2 OFFSET_X (16h) Table 11. OFFSET_X register OX7 OX6 Table 12. ...
Page 26
... GZ6 Table 22. GAIN_Z register description GZ7, GZ0 Digital gain trimming for Z-Axis 26/51 OZ5 OZ4 OZ3 GX5 GX4 GX3 GY5 GY4 GY3 GZ5 GZ4 GZ3 Doc ID 14956 Rev 4 AIS326DQ OZ2 OZ1 OZ0 GX2 GX1 GX0 GY2 GY1 GY0 GZ2 GZ1 GZ0 ...
Page 27
... AIS326DQ 7.8 CTRL_REG1 (20h) Table 23. CTRL_REG1 register PD1 PD0 Table 24. CTRL_REG1 register description Power down control PD1, PD0 (00: power-down mode; 01, 10, 11: device on) Decimation factor control DF1, DF0 (00: decimate by 512; 01: decimate by 128; 10: decimate by 32; 11: decimate by 8) Self test enable ST (0: normal mode; 1: self-test active) ...
Page 28
... BOOT bit is set again to ‘0’. IEN bit is used to switch the value present on data-ready pad between Data-Ready signal and Interrupt signal. At power up the Data-ready signal is chosen however necessary to modify DRDY bit to enable Data-Ready signal generation. 28/51 Doc ID 14956 Rev 4 AIS326DQ ...
Page 29
... AIS326DQ DRDY bit is used to enable Data-Ready (RDY/INT) pin activation. If DRDY bit is ‘0’ (default value) on Data-Ready pad a ‘0’ value is present Data-Ready signal is desired it is necessary to set to ‘1’ DRDY bit. Data-Ready signal goes to ‘1’ whenever a new data is available for all the enabled axis. For example if Z-axis is disabled, Data-Ready signal goes to ‘ ...
Page 30
... OUTX_L (28h) Table 31. OUTX_L register XD7 XD6 Table 32. OUTX_L register description XD7, XD0 X axis acceleration data LSB 30/51 0.318 -------------- - = f cutoff Hpc ZOR YOR XOR XD5 XD4 Doc ID 14956 Rev 4 ODRx ---------------- - ⋅ 2 ZYXDA ZDA YDA XD3 XD2 XD1 AIS326DQ XDA XD0 ...
Page 31
... AIS326DQ In big endian mode (bit BLE in CTRL_REG2 set to ‘1’) the content of this register is the MSB acceleration data and depends on bit DAS in CTRL_REG2 register as described in the following section. 7.14 OUTX_H (29h) Table 33. OUTX_H register XD15 XD14 Table 34. OUTX_H register description XD15, XD8 X axis acceleration data MSB When reading the register in “ ...
Page 32
... ZD15-ZD12=ZD11, ZD11, ZD11, ZD11). In big endian mode (bit BLE in CTRL_REG2 set to ‘1’) the content of this register is the LSB acceleration data. 32/51 ZD5 ZD4 ZD3 ZD13 ZD12 ZD11 Doc ID 14956 Rev 4 AIS326DQ ZD2 ZD1 ZD0 ZD10 ZD9 ZD8 ...
Page 33
... AIS326DQ 7.19 FF_WU_CFG (30h) Table 43. FF_WU_CFG register AOI LIR Table 44. FF_WU_CFG register description And/Or combination of Interrupt events. Default value: 0. AOI (0: OR combination of interrupt events; 1: AND combination of interrupt events) Latch interrupt request. Default value: 0. LIR (0: interrupt request not latched; 1: interrupt request latched) Enable Interrupt request on Z High event ...
Page 34
... Table 47. FF_WU_THS_L register THS7 THS6 Table 48. FF_WU_THS_L register description THS7, THS0 Free-fall / inertial wake up acceleration threshold LSB 7.23 FF_WU_THS_H (35h) Table 49. FF_WU_THS_H register THS15 THS14 34/ THS5 THS4 THS3 THS13 THS12 THS11 Doc ID 14956 Rev 4 AIS326DQ THS2 THS1 THS0 THS10 THS9 THS8 ...
Page 35
... AIS326DQ Table 50. FF_WU_THS_H register description THS15, THS8 Free-fall / inertial wake up acceleration threshold MSB Doc ID 14956 Rev 4 Register description 35/51 ...
Page 36
... Enable interrupt generation on Y high event. Default value: 0 YHIE (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) 36/51 FWD5 FWD4 Minimum duration of the Free-fall/Wake-up event FF_WU_DURATION (Dec) Duration ----------------------------------------------------------------------- - ZHIE ZLIE Doc ID 14956 Rev 4 FWD3 FWD2 FWD1 ODR YHIE YLIE XHIE AIS326DQ FWD0 XLIE ...
Page 37
... AIS326DQ Table 54. DD_CFG register description (continued) Enable interrupt generation on Y low event. Default value: 0 YLIE (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) Enable interrupt generation on X high event. Default value: 0 XHIE (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) Enable interrupt generation on X low event ...
Page 38
... Direction detection internal threshold LSB THSI13 THSI12 Direction detection internal threshold MSB THSE5 THSE4 Direction detection external threshold LSB THSE13 THSE12 THSE11 Doc ID 14956 Rev 4 THSI3 THSI2 THSI1 THSI11 THSI10 THSI9 THSE3 THSE2 THSE1 THSE10 THSE9 AIS326DQ THSI0 THSI8 THSE0 THSE8 ...
Page 39
... AIS326DQ Table 64. DD_THSE_H register description THSE15, THSE8 Direction detection external threshold MSB Doc ID 14956 Rev 4 Register description 39/51 ...
Page 40
... Figure 14. Y-axis sensitivity at 3 940 Figure 16. Z-axis sensitivity at 3 940 Doc ID 14956 Rev 4 AIS326DQ 960 980 1000 1020 1040 1060 1080 1100 Sensitivity [LSB/g] 960 980 1000 1020 1040 1060 1080 1100 Sensitivity [LSB/g] 960 980 1000 1020 1040 1060 1080 1100 Sensitivity [LSB/g] ...
Page 41
... AIS326DQ 8.2 Mechanical characteristics at -40 °C Figure 17. X-axis zero-g level at 3 −80 −60 −40 −20 0 Zero−g Level Offset [mg] Figure 19. Y-axis zero-g level at 3 −80 −60 −40 −20 0 Zero−g Level Offset [mg] Figure 21. Z-axis zero-g level at 3 −80 −60 −40 −20 0 Zero− ...
Page 42
... Doc ID 14956 Rev 4 920 940 960 980 1000 1020 1040 1060 Sensitivity [LSB/g] 940 960 980 1000 1020 1040 1060 1080 Sensitivity [LSB/g] 920 940 960 980 1000 1020 1040 1060 Sensitivity [LSB/g] AIS326DQ 1080 1100 1100 1120 1080 1100 ...
Page 43
... AIS326DQ 8.4 Mechanical characteristics derived from measurement in the -40 °C to +105 °C temperature range Figure 29. X-axis zero-g level change vs. temperature at 3.3 V 100 −20 −40 −60 −80 −100 −50 − Temp [ C] Figure 31. Y-axis zero-g level change vs. temperature at 3.3 V 100 −20 −40 −60 −80 − ...
Page 44
... Figure 38. Z axis sensitivity as function −1 −2 −3 −4 −5 3.4 3.5 3.6 3 Doc ID 14956 Rev 4 AIS326DQ of supply voltage 3.1 3.2 3.3 3.4 3.5 Vdd [V] supply voltage 3.1 3.2 3.3 3.4 3.5 Vdd [V] 3.6 3.6 ...
Page 45
... AIS326DQ 8.6 Electrical characteristics at 25 °C Figure 39. Current consumption in power- down mode (Vdd=3 −2 − Current consumption [uA] 8.7 Electrical characteristics at -40 °C Figure 41. Current consumption in power- down mode (Vdd=3 −2 − Current consumption [uA] 8.8 Electrical characteristics at 105 °C Figure 43. Current consumption in power- down mode (Vdd=3 ...
Page 46
... Central die pad and “Pin 1 Indicator” are physically connected to GND. Leave “Pin 1 Indicator” unconnected during soldering. 46/51 ® , RoHS and “Green” standard. Doc ID 14956 Rev 4 AIS326DQ Figure 45. Refer to ...
Page 47
... AIS326DQ 9.2.1 PCB design rules Figure 45. Recommended land and solder mask design for QFPN packages Clearance from PCB land edge to solder mask opening ≤ 0 ensure that some solder mask remains between PCB pads B = PCB land length = QFPN solder pad length + 0 PCB land width = QFPN solder pad width + 0 ...
Page 48
... The PCB soldering profile depends on the number, size and placement of components in the application board not functional to define a specific soldering profile for the accelerometer only. Customer should use a time and temperature reflow profile that is derived from the PCB design and manufacturing experience. 48/51 Doc ID 14956 Rev 4 AIS326DQ ...
Page 49
... AIS326DQ 10 Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. Figure 46. QFPN-28 mechanical data and package dimensions DIM. ...
Page 50
... Revision history 11 Revision history Table 65. Document revision history Date 20-Aug-2008 04-Dec-2008 30-Apr-2010 01-Jun-2010 50/51 Revision 1 Initial release. Table 3 2 Updated Section 4: Application 3 Updated Content reworked on cover page to improve readability, no technical 4 changes. Doc ID 14956 Rev 4 AIS326DQ Changes Table 4. and IddPdn in hints. ...
Page 51
... AIS326DQ Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...