PIC32MX440F128L-80I/BG Microchip Technology, PIC32MX440F128L-80I/BG Datasheet - Page 122

IC, 32BIT MCU, PIC32, 80MHZ, BGA-100

PIC32MX440F128L-80I/BG

Manufacturer Part Number
PIC32MX440F128L-80I/BG
Description
IC, 32BIT MCU, PIC32, 80MHZ, BGA-100
Manufacturer
Microchip Technology
Series
PIC® 32MXr

Specifications of PIC32MX440F128L-80I/BG

Controller Family/series
PIC32
Ram Memory Size
32KB
Cpu Speed
80MHz
No. Of Timers
5
Interface
EUSART, I2C, SPI, USB
No. Of Pwm Channels
5
Core Size
32 Bit
Program Memory Size
128 KB
Core Processor
MIPS32® M4K™
Speed
80MHz
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
121-TFBGA
Embedded Interface Type
EUSART, I2C, SPI, USB
Rohs Compliant
Yes
Processor Series
PIC32MX4xx
Core
MIPS
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
EUART, I2C, SPI
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
85
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM320003, DM320002, MA320002
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1000 - PIC32 BREAKOUT BOARD
Number Of I /o
-
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC32MX440F128L-80I/BG
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC32MX3XX/4XX
28.1
TABLE 28-1:
TABLE 28-2:
TABLE 28-3:
TABLE 28-4:
DS61143F-page 120
DC5
Note 1:
PIC32MX3XX/4XX
Power Dissipation:
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 100-Pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-Pin TQFP (10x10x1 mm)
Package Thermal Resistance, 64-Pin QFN (9x9x0,9 mm)
Note 1:
DC CHARACTERISTICS
Operating Voltage
DC10
DC12
DC16
DC17
Note 1:
Characteristic
Param.
No.
Operating Junction Temperature Range
DC Characteristics
P
I/O = S ({V
Operating Ambient Temperature Range
Supply Voltage
V
V
V
S
Symbol
INT
DD
DR
POR
VDD
40 MHz maximum for PIC32MX 40MHz family variants.
Junction to ambient thermal resistance, Theta-
This is the limit to which V
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DD
RAM Data Retention Voltage
(Note 1)
V
to Ensure Internal
Power-on Reset Signal
V
to Ensure Internal
Power-on Reset Signal
x (I
DD
DD
– V
V
DD
(in Volts)
Start Voltage
Rise Rate
DD
2.3-3.6V
Characteristics
OH
– S I
Characteristics
Range
} x I
Rating
OH
OH
)
) + S (V
DD
can be lowered without losing RAM data.
OL
x I
OL
Preliminary
-40°C to +85°C
))
Temp. Range
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
(in °C)
Min.
1.75
1.75
0.05
2.3
JA
(
θ
JA
) numbers are achieved by package simulations.
Typical
Symbol
Symbol Typical
P
DMAX
θ
θ
θ
P
T
T
JA
JA
JA
A
D
J
Max.
1.95
3.6
-40°C ≤ T
Min.
-40
-40
43
47
28
Units
V/ms
(T
PIC32MX3XX/4XX
V
V
V
© 2009 Microchip Technology Inc.
P
Max. Frequency
80 MHz (Note 1)
A
J
INT
Typical
– T
Max.
≤ +85°C for Industrial
+ P
A
)/ θ
I
/
O
JA
Conditions
°C/W
°C/W
°C/W
Max.
+125
Unit
+85
Notes
Unit
°C
°C
W
W
1
1
1

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