VNH3SP30-E STMicroelectronics, VNH3SP30-E Datasheet
VNH3SP30-E
Specifications of VNH3SP30-E
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VNH3SP30-E Summary of contents
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... V CC ® ■ Package: ECOPACK Description The VNH3SP30 full-bridge motor driver intended for a wide range of automotive applications. The device incorporates a dual monolithic high-side driver (HSD) and two low- side switches. The HSD switch is designed using STMicroelectronics proprietary VIPower™ M0-3 technology that efficiently integrates a true Power MOSFET with an intelligent signal/protection circuit on the same die ...
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... Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2/33 Thermal calculation in clockwise and anti-clockwise operation in steady- state mode 26 Thermal resistances definition (values according to the PCB heatsink area Thermal calculation in transient mode . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Single pulse thermal impedance definition (values according to the PCB heatsink area VNH3SP30-E ...
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... VNH3SP30-E List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Block description Table 3. Pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Pin functions description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 5. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 6. Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 7. Logic inputs (INA, INB, ENA, ENB Table 8. PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 9. Switching (V = 13V Table 10. Protection and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 11 ...
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... Figure 42. MultiPowerSO-30 LSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . 27 Figure 43. Thermal fitting model of an H-bridge in MultiPowerSO- Figure 44. MultiPowerSO-30 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 45. MultiPowerSO-30 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 46. MultiPowerSO-30 tube shipment (no suffix Figure 47. MultiPowerSO-30 tape and reel shipment (suffix “TR” 4/33 VNH3SP30-E ...
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... VNH3SP30-E 1 Block diagram and pins description Figure 1. Block diagram Table 2. Block description Name Logic control Overvoltage + undervoltage High side and low side clamp voltage High side and low side driver Linear current limiter Overtemperature protection Fault detection Description Allows the turn-on and the turn-off of the high side and the low side switches according to the truth table Shuts down the device outside the range [5 ...
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... Counter clockwise input B /DIAG Status of high side and low side switches B; open drain output Heat Slug2 Source of high side switch B / Drain of low side switch B B Source of low side switch A A Source of low side switch B B must be externally connected together. VNH3SP30-E Function (1) (1) ...
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... VNH3SP30-E Table 4. Pin functions description Name V Battery connection CC GND , GND Power grounds; must always be externally connected together A B OUT , OUT Power connections to the motor A B Voltage controlled input pins with hysteresis, CMOS compatible. These two pins control the state of the bridge in normal operation according to the truth table (brake ...
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... ESD – output pins: OUT T Junction operating temperature j T Case operating temperature c T Storage temperature STG 8/33 Parameter and IN pins /EN and DIAG / OUT , VNH3SP30-E Value -0.3...40 30 -30 ±10 ±10 pins) ± Internally limited -40 to 150 -55 to 150 Unit °C ...
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... VNH3SP30-E 2.2 Electrical characteristics Vcc = 18V; -40°C < T Table 6. Power section Symbol Parameter Operating supply V CC voltage I Supply current S Static high side R ONHS resistance Static low side R ONLS resistance High side free- V wheeling diode f forward voltage High side off state I output current ...
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... CC LOAD Parameter Test Conditions Input rise time < 1µs (see Figure 6) Input rise time < 1µs (see Figure 6) (see Figure 5) (see Figure 5) (see Figure 4) Parameter VNH3SP30-E Min Typ Max 1 3. -3.5 -3.5 -2 -0.5 -2000 -500 Ω , unless otherwise specified) ...
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... VNH3SP30-E Figure 4. Definition of the delay times measurement V INA V INB PWM I LOAD Figure 5. Definition of the low side switching times t DEL PWM V OUTA 20% Electrical specifications DEL t 80 11/33 ...
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... Electrical specifications Figure 6. Definition of the high side switching times V INA V OUTA 12/ D(on) D(off) 90% 10% VNH3SP30 ...
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... VNH3SP30-E Table 11. Truth table in normal operating conditions IN IN DIAG Table 12. Truth table in fault conditions (detected on OUT Note: Notice that saturation detection on the low side power MOSFET is possible only if the impedance of the short-circuit from the output to the battery is less than 100m device is supplied with a battery voltage of 13.5V. ...
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... Test Level Test Levels III IV Delays and Impedance -100V 2ms, 10Ω +100V 0.2ms, 10Ω -150V 0.1µs, 50Ω +100V -6V -7V 100ms, 0.01Ω +86.5V 400ms, 2Ω Test Levels Test Levels Result III C E Contents VNH3SP30-E Result ...
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... VNH3SP30-E 2.3 Electrical characteristics curves Figure 7. On state supply current Figure 9. High level input current Figure 11. Input high level voltage Electrical specifications Figure 8. Off state supply current Figure 10. Input clamp voltage Figure 12. Input low level voltage 15/33 ...
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... Electrical specifications Figure 13. Input hysteresis voltage Figure 15. Delay time during change of operation mode Figure 17. High level enable voltage 16/33 Figure 14. High level enable pin current Figure 16. Enable clamp voltage Figure 18. Low level enable voltage VNH3SP30-E ...
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... VNH3SP30-E Figure 19. PWM high level voltage Figure 21. PWM high level current Figure 23. Undervoltage shutdown Electrical specifications Figure 20. PWM low level voltage Figure 22. Overvoltage shutdown Figure 24. Current limitation 17/33 ...
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... Figure 25. On state high side resistance vs T case Figure 27. On state high side resistance vs Vcc Figure 29. Output voltage rise time 18/33 Figure 26. On state low side resistance vs T case Figure 28. On state low side resistance vs Vcc Figure 30. Output voltage fall time VNH3SP30-E ...
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... VNH3SP30-E Figure 31. Enable output low level voltage Electrical specifications Figure 32. ON state leg resistance 19/33 ...
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... MOSFET) 20/33 /EN pin is considered as an input pin by the turn on again depending on the input pin state /EN pin is considered as an output pin by the device VNH3SP30-E and LS switches ...
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... The device sustains no more than -30A in reverse battery conditions because of the two body diodes of the power MOSFETs. Additionally, in reverse battery condition the I/Os of VNH3SP30-E will be pulled down to the V must be inserted to limit the current sunk from the microcontroller I/Os maximum target reverse current through µC I/Os, the series resistor is: 3 ...
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... Figure 34. Half-bridge configuration DIAG /EN A DIAG /EN B PWM OUT A GND Note: The VNH3SP30-E can be used as a high power half-bridge driver achieving an On resistance per leg of 22.5mΩ . Figure 35. Multi-motors configuration DIAG /EN A DIAG /EN B PWM OUT A GND ...
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... VNH3SP30-E Figure 36. Waveforms in full bridge operation Application information 23/33 ...
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... Application information Figure 37. Waveforms in full bridge operation (continued) 24/33 VNH3SP30-E ...
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... VNH3SP30-E 4 Package and PCB thermal data 4.1 MultiPowerSO-30 thermal data Figure 38. MultiPowerSO-30™ PC board Note: Layout condition of R thickness = 2mm, Cu thickness = 35µm, Copper areas: from minimum pad layout to 2 16cm ). Figure 39. Chipset configuration Figure 40. Auto and mutual R condition and Z measurements (PCB FR4 area = 58mm x 58mm, PCB ...
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... Mutual Thermal Impedance Junction to Ambient thHSABLSB = Mutual Thermal Impedance Junction to Ambient between Low Side values set by user jLSA thHSLS dHSA thLSLS amb thLS thHSLS dHSB thLS amb thLSLS ( dLSB amb dLSB amb thLS dLSB amb VNH3SP30-E jLSB + P thHSLS dLSB amb + P thHSLS dLSA + T amb or A ...
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... VNH3SP30-E Equation 1: pulse calculation formula ⋅ δ Z THtp 1 δ Z THδ where δ Figure 41. MultiPowerSO-30 HSD thermal impedance junction ambient single pulse 100 10 1 0.1 0.001 Figure 42. MultiPowerSO-30 LSD thermal impedance junction ambient single pulse 100 10 1 0,1 0,001 ( ) + – ⁄ ...
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... C14 = C20 (W.s/°C) 1. The blank space means that the value is the same as the previous one. 28/33 ( Footprint 0.05 0.3 0.5 1.3 14 44.7 0.6 0.8 1.5 20 46.9 115 0.001 0.005 0.02 0.3 0.6 5 0.003 0.075 2.5 VNH3SP30 39.1 31.6 23.7 36.1 30.4 20 3.5 4.5 5 ...
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... VNH3SP30-E 5 Package and packing information 5.1 ECOPACK® packages In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second-level interconnect. The category of Second-Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. ...
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... Table 16. MultiPowerSO-30 mechanical data Symbol Figure 45. MultiPowerSO-30 suggested pad layout 30/33 Millimeters Min Typ 1.85 0 0.42 0.23 17.1 17.2 18.85 15 5.55 4.6 9.6 0.8 0deg VNH3SP30-E Max 2.35 2.25 0.1 0.58 0.32 17.3 19.15 16.1 6.05 5.1 10.1 1.15 10deg 7deg ...
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... VNH3SP30-E 5.3 Packing information Note: The devices can be packed in tube or tape and reel shipments (see the page 1 for packaging quantities). Figure 46. MultiPowerSO-30 tube shipment (no suffix) C Figure 47. MultiPowerSO-30 tape and reel shipment (suffix “TR”) Dimension A Tube length (± 0. (± 0.13) Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev ...
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... Corrected Figure 34 note : changed On resistance per leg from 9.5 6 mΩ to 22.5 mΩ Corrected Heat Slug numbers in Description of changes package. ® and I in Table 6 on INL INH to Figure 7 on D(off) : supply current and static 5. Table 3: Pin definitions and VNH3SP30 DIAG functions. ...
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... VNH3SP30-E Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...