PIC18F4585-E/ML Microchip Technology, PIC18F4585-E/ML Datasheet - Page 4

IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,LLCC,44PIN,PLASTIC

PIC18F4585-E/ML

Manufacturer Part Number
PIC18F4585-E/ML
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,LLCC,44PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F4585-E/ML

Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
25MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
36
Program Memory Size
48KB (24K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
44-QFN
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.25 KB
Interface Type
I2C, SPI, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
44
Number Of Timers
1 x 8
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163011
Minimum Operating Temperature
- 40 C
On-chip Adc
11 bit
Height
0.88 mm
Length
8 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.2 V
Width
8 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB18F4680 - BOARD DAUGHTER ICEPIC3
Lead Free Status / Rohs Status
 Details
PIC18F2585/2680/4585/4680
16. Module: MSSP
TABLE 1:
17. Module: MSSP
DS80283E-page 4
Note 1:
In its current implementation, the I
mode operates as follows:
1. The Baud Rate Generator for I
RCEN becomes set when the system is idle. In
normal operation, the setting of RCEN should be
ignored by the module while the system is not idle.
Work around
Wait for the system to become idle. This requires
a check for the following bits to be reset:
ACKEN, RCEN, PEN, RSEN and SEN.
Date Codes that pertain to this issue:
All engineering and production devices.
40 MHz
40 MHz
40 MHz
16 MHz
16 MHz
16 MHz
mode is slower than the rates specified in
Table 17-3 of the Device Data Sheet.
For this revision of silicon, use the values
shown in Table 1 in place of those shown in
Table 17-3 of the Device Data Sheet. The
differences are shown in bold text.
4 MHz
4 MHz
4 MHz
F
OSC
The I
100 kHz) in all details, but may be used with care where higher rates are required by the application.
I
2
2
C™ interface does not conform to the 400 kHz I
C™ CLOCK RATE w/BRG
10 MHz
10 MHz
10 MHz
4 MHz
4 MHz
4 MHz
1 MHz
1 MHz
1 MHz
F
CY
2
2
C in Master
C™ Master
20 MHz
20 MHz
20 MHz
8 MHz
8 MHz
8 MHz
2 MHz
2 MHz
2 MHz
F
CY
*2
18. Module: MSSP
2
C specification (which applies to rates greater than
2. Use the following formula in place of the one
In an I
unaddressed slave may respond to bus activity
when data on the bus matches its address. The
first occurrence will set the BF bit. The second
occurrence will set the BF and the SSPOV bits. In
both situations, the SSPIF bit is not set and an
interrupt will not occur. The device will vector to the
Interrupt Service Routine only if the interrupt is
enabled and an address match occurs.
Work around
The I
I
Date Codes that pertain to this issue:
All engineering and production devices.
2
C event to maintain normal operation.
SSPADD = INT((F
shown in Register 17-4 (SSPCON1) of the
Device
SSPM3:SSPM0 = 1000.
2
C slave must clear the SSPOV bit after each
2
C system with multiple slave nodes, an
BRG Value
0Eh
15h
59h
05h
08h
23h
01h
08h
00h
Data
© 2007 Microchip Technology Inc.
CY
Sheet
/F
SCL
(2 Rollovers of BRG)
) – (F
for
CY
400 kHz
400 kHz
333 kHz
312.5 kHz
bit
1 MHz
100 kHz
308 kHz
100 kHz
100 kHz
/1.111 MHz)) – 1
F
SCL
description,
(1)
(1)
(1)
(1)

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