S29GL064M11TFIR40 Spansion Inc., S29GL064M11TFIR40 Datasheet - Page 107

• Manufacturer Part Number: S29GL064M11TFIR40
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.
• Series: S29GLr

Specifications of S29GL064M11TFIR40

• Memory Size: 64Mbit
• Package/case: 48-TSOP
• Supply Voltage Max: 3V
• Leaded Process Compatible: Yes
• Peak Reflow Compatible (260 C): Yes
• Access Time, Tacc: 11nS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Physical Dimensions
LAC064—64-Pin 18 x 12 mm Package
February 7, 2007 S29GL-M_00_B8
A
PACKAGE
JEDEC
SYMBOL
SD / SE
CORNER
A2
MD
ME
A1
A2
D1
E1
eD
eE
φb
D
N
0.20
A
E
A1
2X
A1
C
0.40
0.60
0.50
MIN
---
18.00 mm x 12.00 mm
1.00±0.5
18.00 BSC.
12.00 BSC.
PACKAGE
7.00 BSC.
7.00 BSC.
1.00 BSC.
1.00 BSC.
0.50 BSC.
A1 CORNER ID.
(INK OR LASER)
LAC 064
NONE
NOM
0.60
N/A
---
---
---
64
8
8
SIDE VIEW
TOP VIEW
MAX
1.40
0.70
---
---
D
PROFILE HEIGHT
STANDOFF
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH - D DIRECTION
BALL PITCH - E DIRECTION
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
SEATING PLANE
D a t a
S29GL-M MirrorBit
NOTE
S h e e t
A
C
0.20
2X
E
B
C
0.25
eE
0.15 C
TM
C
Flash Family
6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
NXφb
e REPRESENTS THE SOLDER BALL GRID PITCH.
φ 0.25
φ 0.10
eD
M C
M
C
H
A
B
G
BOTTOM VIEW
F
E
D1
D
SD
C
B
7
A
8
7
6
5
4
3
2
1
3243 \ 16-038.12d
CORNER
SE
A1
7
E1
105