S29GL064M11TFIR40 Spansion Inc., S29GL064M11TFIR40 Datasheet - Page 112

• Manufacturer Part Number: S29GL064M11TFIR40
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.
• Series: S29GLr

Specifications of S29GL064M11TFIR40

• Memory Size: 64Mbit
• Package/case: 48-TSOP
• Supply Voltage Max: 3V
• Leaded Process Compatible: Yes
• Peak Reflow Compatible (260 C): Yes
• Access Time, Tacc: 11nS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Revision Summary
Revision A (January 29, 2004)
Revision A1 (February 23, 2004)
110
Initial Release.
Connection Diagrams
Removed 80-ball Fine-pitch BGA pinout.
Ordering Information
Added additional packing type.
Removed frame description from package material set.
Updated valid combinations to reflect the addition of new package type.
Added marking descriptions to all valid combination tables.
Word Program Command Sequence and Unlock Bypass
Command Sequence
Added these sections.
Figure 3, Write Buffer Programming Operation, Figure 4,
Program Operation
Updated figure.
Table 34, “Command Definitions( x16 Mode, BYTE# = V
page 69
Updated table.
Added note 19.
Table 35, “Command Definitions (x8 Mode, BYTE# = V
page 70
Updated table.
Added note 17.
Figure 7, Data# Polling Algorithm
Updated figure.
Erase and Program Operations and Alternate CE# Controlled
Erase and Program Operations
Updated T
Added Note 4.
Program Operation Timings, Chip/Sector Erase Operation
Timings, Toggle Bit Timings (During Embedded Algorithms),
Alternate CE# Controlled Write (Erase/
Program) Operation Timings figures
Updated figures.
Physical Dimensions
Removed BGA-63P-M02 and BGA-80P-M01. Added the TS040 package
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S29GL-M_00_B8 February 7, 2007