STM32F103ZGH6 STMicroelectronics, STM32F103ZGH6 Datasheet - Page 43
![MCU 32BIT 1MB FLASH 144LQFP](/photos/39/71/397107/lqfp-144_sml.jpg)
STM32F103ZGH6
Manufacturer Part Number
STM32F103ZGH6
Description
MCU 32BIT 1MB FLASH 144LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F103VGT6.pdf
(120 pages)
Specifications of STM32F103ZGH6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, MMC, SPI, UART/USART, USB
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
112
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 21x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Processor Series
STM32F101xG
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
80 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
112
Number Of Timers
15
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Operating Temperature Range
- 40 C to + 105 C
Processor To Be Evaluated
STM32F103ZG
Supply Current (max)
28 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
497-11115
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F103ZGH6
Manufacturer:
STMicroelectronics
Quantity:
135
Company:
Part Number:
STM32F103ZGH6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F103ZGH6
Manufacturer:
ST
Quantity:
20 000
STM32F103xF, STM32F103xG
5.3.4
5.3.5
Embedded reference voltage
The parameters given in
temperature and V
Table 13.
1. Shortest sampling time can be determined in the application by multiple iterations.
2. Guaranteed by design, not tested in production.
Supply current characteristics
The current consumption is a function of several parameters and factors such as the
operating voltage, ambient temperature, I/O pin loading, device software configuration,
operating frequencies, I/O pin switching rate, program location in memory and executed
binary code.
The current consumption is measured as described in
measurement
All Run-mode current consumption measurements given in this section are performed with a
reduced code that gives a consumption equivalent to Dhrystone 2.1 code.
Maximum current consumption
The MCU is placed under the following conditions:
●
●
●
●
●
The parameters given in
under ambient temperature and V
T
V
Symbol
V
S_vrefint
T
RERINT
Coeff
REFINT
All I/O pins are in input mode with a static value at V
All peripherals are disabled except when explicitly mentioned
The Flash memory access time is adjusted to the f
to 24 MHz, 1 wait state from 24 to 48 MHz and 2 wait states above)
Prefetch in ON (reminder: this bit must be set before clock setting and bus prescaling)
When the peripherals are enabled f
(2)
(2)
(1)
Internal reference voltage
ADC sampling time when
reading the internal reference
voltage
Internal reference voltage
spread over the temperature
range
Temperature coefficient
Embedded internal reference voltage
scheme.
DD
Parameter
supply voltage conditions summarized in
Table 13
Table
Doc ID 16554 Rev 2
14,
DD
are derived from tests performed under ambient
Table 15
supply voltage conditions summarized in
PCLK1
–40 °C < T
–40 °C < T
V
DD
and
Conditions
= 3 V ±10 mV
= f
Table 16
HCLK
A
A
< +105 °C
< +85 °C
/2, f
Figure 11: Current consumption
HCLK
DD
are derived from tests performed
PCLK2
or V
frequency (0 wait state from 0
Table
1.16 1.20
1.16 1.20
Min
= f
SS
Electrical characteristics
HCLK
(no load)
10.
5.1
Typ
1.26
1.24
17.1
Max
100
10
Table
(2)
ppm/°C
10.
Unit
43/120
mV
µs
V
V