TFBS6711-TR1 Vishay, TFBS6711-TR1 Datasheet - Page 9

• Manufacturer Part Number: TFBS6711-TR1
• Description: IRDA FIR TRANSCEIVER 1,9MM-e4
• Manufacturer: Vishay

Specifications of TFBS6711-TR1

• Data Rate Max: 4Mbps
• Data Transmission Distance: 30cm
• Peak Wavelength: 900nm
• Supply Current: 1.9mA
• Supply Voltage Range: 2.4V To 3.6V
• Operating Temperature Range: -25°C To +85°C
• Msl: MSL 4 - 72 Hours
• External: RoHS Compliant
• External Depth: 1.9mm
• Rohs Compliant: Yes
• Current Ilireda: 1µA
• Svhc: No SVHC (20-Jun-2011)

TFBS6711
Vishay Semiconductors
Recommended Solder Profiles
Solder Profile for Sn/Pb soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFBS6711 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in
figure 6 is VISHAY's recommended profiles for use
with the TFBS6711 transceivers. For more details
please refer to Application note: SMD Assembly
Instruction.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
www.vishay.com
266
260
240
220
200
180
160
140
120
100
80
60
40
20
Figure 5. Recommended Solder Profile for Sn/Pb soldering
0
0
2...4 °C/s
50
100
160 °C max.
120 s...180 s
240 °C max.
150
Time/s
200
2...4 °C/s
10 s max. at 230 °C
250
90 s max.
300
19431
350
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
19261
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2 °C...4 °C/s
Figure 6. Solder Profile, RSS Recommendation
50
T ≥ 255 °C for 20 s max
T ≥ 217 °C for 50 s max
100
90 s...120 s
150
Time/s
200
Document Number 84676
50 s max.
20 s
Rev. 1.2, 03-Jul-06
T peak = 260 °C max.
250
2 °C...4 °C/s
300
350