AMMP-6408-TR1G Avago Technologies US Inc., AMMP-6408-TR1G Datasheet - Page 11

• Manufacturer Part Number: AMMP-6408-TR1G
• Description: Power Amp, MMIC, 6-18GHz Pkg
• Manufacturer: Avago Technologies US Inc.

Specifications of AMMP-6408-TR1G

• Current - Supply: 650mA
• Frequency: 6GHz ~ 18GHz
• Gain: 18dB
• P1db: 28.5dBm
• Package / Case: 8-SMD
• Rf Type: LMDS, MMDS
• Test Frequency: 8GHz
• Voltage - Supply: 6V
• Manufacturer's Type: Power Amplifier
• Number Of Channels: 1
• Supply Current: 650@5VmA
• Frequency (max): 18GHz
• Operating Supply Voltage (max): 6V
• Package Type: SMT
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Noise Figure: -
• Lead Free Status / Rohs Status: Compliant

Manual Assembly
• Follow ESD precautions while handling packages.
• Handling should be along the edges with tweezers.
• Recommended attachment is conductive solder
• Apply solder paste using a stencil printer or dot
• Follow solder paste and vendor’s recommendations
• Packages have been qualified to withstand a peak
Figure 22. Suggested lead-free reflow profile for SnAgCu solder paste
Package Dimensions

A
300
250
200
150
100
paste. Please see recommended solder reflow profile.
Neither Conductive epoxy or hand soldering is recom-
mended.
placement. The volume of solder paste will be depen-
dent on PCB and component layout and should be
controlled to ensure consistent mechanical and elec-
trical performance.
when developing a solder reflow profile. A stan-
dard profile will have a steady ramp up from room
temperature to the pre-heat temp. to avoid damage
due to thermal shock.
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
50
0
0
8
RAMP 1
SYMBOL
A
B
DIMENSIONS ARE IN INCHES (MM)
AMMP
XXXX
YWWDNN
50
FRONT VIEW
1
7
PREHEAT
A
2
6
0.0685 (1.74)
0.198 (5.03)
MIN.
100
3
5
RAMP 2
PEAK = 250 ± 5 C
TIME (SECONDS)
150
4
0.088 (2.25)
0.213 (5.4)
REFLOW
MAX.
MELTING POINT = 218 C
SIDE VIEW
200
B
COOLING
250
0.126
(3.2)
0.029 (0.75)
300
0.059
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout
is shown in Figure 2. The stencil has a solder paste
deposition opening approximately 70% to 90% of the
PCB pad. Reducing stencil opening can potentially
generate more voids underneath. On the other
hand, stencil openings larger than 00% will lead to
excessive solder paste smear or bridging across the I/O
pads. Considering the fact that solder paste thickness
will directly affect the quality of the solder joint, a
good choice is to use a laser cut stencil composed of
0.27 mm (5 mils) thick stainless steel which is capable
of producing the required fine stencil outline.
The most commonly used solder reflow method is
accomplished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 22. This profile is
designed to ensure reliable finished joints. However, the
profile indicated in Figure  will vary among different
solder pastes from different manufacturers and is shown
here for reference only.
Ordering Information
AMMP-6408 Part Number Ordering Information
Part Number
AMMP-6408-BLKG
AMMP-6408-TRG
AMMP-6408-TR2G
(1.5)
0.016 (0.40)
0.100 (2.54)
0.100 (2.54)
0.011 (0.28)
DIMENSIONAL TOLERANCE: 0.002" (0.05 mm)
4
BACK VIEW
0.114 (2.90)
0.018 (0.46)
3
0.93 (2.36)
5
Devices per
Container
0
00
500
2
6
1
7
*
0.028 (0.70)
8
Container
Antistatic bag
7” Reel
7” Reel
0.012 (0.30)
0.014 (0.365)
0.016 (0.40)