HSDL-3602-008 Avago Technologies US Inc., HSDL-3602-008 Datasheet - Page 13

• Manufacturer Part Number: HSDL-3602-008
• Description: Infrared Transceivers 1m 3V FIR 400units t op options
• Manufacturer: Avago Technologies US Inc.

Specifications of HSDL-3602-008

• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 1.5 m
• Radiant Intensity: 250 mW/sr
• Half Intensity Angle Degrees: 30 deg
• Pulse Width: 1.6 us, 4 us
• Maximum Rise Time: 40 ns, 25 ns
• Maximum Fall Time: 40 ns, 25 ns
• Led Supply Voltage: - 0.5 V to 7 V
• Maximum Forward Current: 165 mA
• Operating Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 20 C
• Dimensions: 12.2 mm x 4.9 mm x 4 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13
Recommended Reflow Profile
The reflow profile is a straight-line representation of
a nominal temperature profile for a convective reflow
solder process. The temperature profile is divided into
four process zones, each with different ∆T/∆time tem-
perature change rates. The ∆T/∆time rates are detailed
in the following table. The temperatures are measured
at the component to printed circuit board connections.
In process zone P1, the PC board and HSDL-3602 cas-
tellation pins are heated to a temperature of 160°C to
activate the flux in the solder paste. The temperature
ramp up rate, R1, is limited to 4°C per second to allow
for even heating of both the PC board and HSDL-3602
castellations.
Process zone P2 should be of sufficient time duration
(60 to 120 seconds) to dry the solder paste. The tem-
perature is raised to a level just below the liquidus point
of the solder, usually 200°C (392°F).
Process zone P3 is the solder reflow zone. In zone P3, the
temperature is quickly raised above the liquidus point
of solder to 255°C (491°F) for optimum results. The
dwell time above the liquidus point of solder should
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
255
230
220
200
180
160
120
80
25
0
HEAT
R1
UP
P1
50
SOLDER PASTE DRY
R2
P2
100
t-TIME (SECONDS)
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
150
R3
MAX. 260 C
REFLOW
SOLDER
60 sec.
ABOVE
MAX.
220 C
P3
200
R4
DOWN
COOL
be between 20 and 60 seconds. It usually takes about
20 seconds to assure proper coalescing of the solder
balls into liquid solder and the formation of good solder
connections. Beyond a dwell time of 60 seconds, the
intermetallic growth within the solder connections be-
comes excessive, resulting in the formation of weak and
unreliable connections. The temperature is then rapidly
reduced to a point below the solidus temperature of
the solder, usually 200°C (392°F), to allow the solder
within the connections to freeze solid.
Process zone P4 is the cool down after solder freeze. The
cool down rate, R5, from the liquidus point of the solder
to 25°C (77°F) should not exceed 6°C per second maxi-
mum. This limitation is necessary to allow the PC board
and HSDL-3602 castellations to change dimensions
evenly, putting minimal stresses on the HSDL-3602
transceiver.
P4
R5
250
∆T
25˚C to 160˚C
160˚C to 200˚C
200˚C to 255˚C
(260˚C at 10 seconds max.)
255˚C to 200˚C
200˚C to 25˚C
300
Maximum
∆T/∆time
4˚C/s
0.5˚C/s
4˚C/s
–6˚C/s
–6˚C/s