HSDL-3602-008 Avago Technologies US Inc., HSDL-3602-008 Datasheet - Page 15

• Manufacturer Part Number: HSDL-3602-008
• Description: Infrared Transceivers 1m 3V FIR 400units t op options
• Manufacturer: Avago Technologies US Inc.

Specifications of HSDL-3602-008

• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 1.5 m
• Radiant Intensity: 250 mW/sr
• Half Intensity Angle Degrees: 30 deg
• Pulse Width: 1.6 us, 4 us
• Maximum Rise Time: 40 ns, 25 ns
• Maximum Fall Time: 40 ns, 25 ns
• Led Supply Voltage: - 0.5 V to 7 V
• Maximum Forward Current: 165 mA
• Operating Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 20 C
• Dimensions: 12.2 mm x 4.9 mm x 4 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

15
1.2. Adjacent Land Keep-out and Solder Mask Areas
Figure 3. HSDL-3602-007/-037 PCBA-Adjacent land keep-out and solder mask.
• Adjacent land keep-out is the maximum space oc-
• “h” is the minimum solder resist strip width required
• It is recommended that 2 fiducial cross be placed at
Note : Wet/Liquid Photo-Imagineable solder resist/mask
is recommended.
Dim.
h
j
k
l
cupied by the unit relative to the land pattern. There
should be no other SMD components within this
area.
to avoid solder bridging adjacent pads.
mid-length of the pads for unit alignment.
LAND
Tx LENS
h
mm
min. 0.2
13.4
4.7
3.2
j
Y
0.528
min. 0.008
inches
0.185
0.126
Rx LENS
SOLDER
MASK
k
l
• ADJACENT LAND KEEP-OUT IS THE
MAXIMUM SPACE OCCUPIED BY THE
UNIT RELATIVE TO THE LAND PATTERN.
THERE SHOULD BE NO OTHER SMD
COMPONENTS WITHIN THIS AREA.
• "h" IS THE MINIMUM SOLDER RESIST
STRIP WIDTH REQUIRED TO AVOID
SOLDER BRIDGING ADJACENT PADS.
• IT IS RECOMMENDED THAT 2 FIDUCIAL
CROSS BE PLACED AT MID-LENGTH OF
THE PADS FOR UNIT ALIGNMENT.
DIM.
h
k
j
l
MIN. 0.2
13.4
mm
4.7
3.2
MIN. 0.008
INCHES
0.528
0.185
0.126