ASDL-3023-021 Avago Technologies US Inc., ASDL-3023-021 Datasheet - Page 15

• Manufacturer Part Number: ASDL-3023-021
• Description: Infrared Transceivers SFF FIR+RC Front w/o Shield
• Manufacturer: Avago Technologies US Inc.

Specifications of ASDL-3023-021

• Wavelength: 885 nm, 875 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 30 cm
• Radiant Intensity: 50 mW/sr
• Half Intensity Angle Degrees: 15 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 60 ns, 600 ns
• Maximum Fall Time: 60 ns, 600 ns
• Led Supply Voltage: - 0.3 V to 6 V
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 7.5 mm x 2.75 mm x 1.75 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Reflow Profile
The reflow profile is a straight-line representation of
a nominal temperature profile for a convective reflow
solder process. The temperature profile is divided into
four process zones, each with different DT/Dtime tem-
perature change rates or duration. The DT/Dtime rates or
duration are detailed in the above table. The tempera-
tures are measured at the component to printed circuit
board connections.
In process zone P1, the PC board and ASDL-3023 pins
are heated to a temperature of 150°C to activate the flux
in the solder paste. The temperature ramp up rate, R1,
is limited to 3°C per second to allow for even heating of
both the PC board and ASDL-3023 pins.
Process zone P2 should be of sufficient time duration
(100 to 180 seconds) to dry the solder paste. The temper-
ature is raised to a level just below the liquidus point of
the solder.
5
150
120
255
230
217
200
180
25
80
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
Time maintained above liquidus point , 7°C
Peak Temperature
Time within 5°C of actual Peak Temperature
Time 5°C to Peak Temperature
0
R1
HEAT
P1
UP
50
SOLDER PASTE DRY
R2
100
P2
Symbol
P, R
P, R
P, R
P, R4
P4, R5
150
DT
5°C to 50°C
50°C to 00°C
00°C to 60°C
60°C to 00°C
00°C to 5°C
> 7°C
60°C
-
5°C to 60°C
Process zone P3 is the solder reflow zone. In zone P3,
the temperature is quickly raised above the liquidus
point of solder to 260°C (500°F) for optimum results. The
dwell time above the liquidus point of solder should be
between 60 and 90 seconds. This is to assure proper co-
alescing of the solder paste into liquid solder and the
formation of good solder connections. Beyond the rec-
ommended dwell time the intermetallic growth within
the solder connections becomes excessive, resulting in
the formation of weak and unreliable connections. The
temperature is then rapidly reduced to a point below
the solidus temperature of the solder to allow the solder
within the connections to freeze solid.
Process zone P4 is the cool down after solder freeze.
The cool down rate, R5, from the liquidus point of the
solder to 25°C (77°F) should not exceed 6°C per second
maximum. This limitation is necessary to allow the PC
board and ASDL-3023 pins to change dimensions evenly,
putting minimal stresses on the ASDL-3023.
It is recommended to perform reflow soldering no more
than twice.
R3
60 sec to 90 sec
Above 217°C
MAX 260°C
200
REFLOW
SOLDER
P3
R4
Maximum DT/Dtime
or Duration
°C/s
00s to 80s
°C/s
-6°C/s
-6°C/s
60s to 90s
-
0s to 40s
8mins
COOL DOWN
250
P4
R5
300
t-TIME
(SECONDS)