PEMI6CSP/RT NXP Semiconductors, PEMI6CSP/RT Datasheet - Page 12
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
PEMI6CSP/RT
Manufacturer Part Number
PEMI6CSP/RT
Description
Manufacturer
NXP Semiconductors
Datasheet
1.PEMI6CSPRT.pdf
(16 pages)
Specifications of PEMI6CSP/RT
Operating Temperature Min Deg. C
-40C
Operating Temperature Max Deg. C
85C
Rad Hardened
No
Lead Free Status / RoHS Status
Compliant
NXP Semiconductors
PEMIXCSP_FAM
Product data sheet
Table 12.
Symbol
T
t
t
t
t
t
dT/dt
1
2
3
4
5
Fig 14. Pb-free solder reflow profile
reflow(peak)
The device is capable of withstanding at least three reflows of this profile.
Characteristics
Parameter
peak reflow temperature
time 1
time 2
time 3
time 4
time 5
rate of change of temperature cooling rate
All information provided in this document is subject to legal disclaimers.
T
reflow(peak)
4-, 6- and 8-channel passive filter network with ESD protection
Rev. 1 — 3 February 2011
(°C)
250
230
217
T
preheat
t
1
Conditions
soak time
time during T ≥ 250 °C
time during T ≥ 230 °C
time during T > 217 °C
pre-heat
t
5
t
2
t
t
PEMIxCSP family
3
4
cooling rate
Min
230
60
-
10
30
-
-
2.5
001aai943
t (s)
Typ
-
-
-
-
-
-
-
-
© NXP B.V. 2011. All rights reserved.
Max
260
180
30
50
150
540
−6
4.0
12 of 16
Unit
°C
s
s
s
s
s
°C/s
°C/s