ADCLK854/PCBZ Analog Devices Inc, ADCLK854/PCBZ Datasheet - Page 13

• Manufacturer Part Number: ADCLK854/PCBZ
• Description: Evaluation Kit For 1.8v 6vvds/12 CMOS Cl
• Manufacturer: Analog Devices Inc

Specifications of ADCLK854/PCBZ

• Design Resources: Clock Distribution Circuit with Pin-Programmable Output Frequency, Output Logic Levels, and Fanout (CN0152)
• Main Purpose: Timing, Clock Buffer / Driver / Receiver / Translator
• Embedded: No
• Utilized Ic / Part: ADCLK854
• Primary Attributes: 2 Inputs, 12 Outputs
• Secondary Attributes: CMOS, LVDS Outputs
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

CONTROL AND FUNCTION PINS
CTRL_A—Logic Select
This pin selects either CMOS (high) or LVDS (low) logic for
Output 3, Output 2, Output 1, and Output 0. This pin has an
internal 200 kΩ pull-down resistor.
CTRL_B—Logic Select
This pin selects either CMOS (high) or LVDS (low) logic for
Output 7, Output 6, Output 5, and Output 4. This pin has an
internal 200 kΩ pull-down resistor.
CTRL_C—Logic Select
This pin selects either CMOS (high) or LVDS (low) logic for
Output 11, Output 10, Output 9, and Output 8. This pin has an
internal 200 kΩ pull-down resistor.
IN_SEL—Clock Input Select
A logic low selects CLK0 and CLK0 whereas a logic high selects
CLK1 and CLK1. This pin has an internal 200 kΩ pull-down
resistor.
Sleep Mode
Sleep mode powers down the chip except for the internal band
gap. The input is active high, which puts the outputs into a
high-Z state. This pin has a 200 kΩ pull-down resistor.
POWER SUPPLY
The ADCLK854 requires a 1.8 V ± 5% power supply for V
practice recommends bypassing the power supply on the PCB
S
. Best
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with adequate capacitance (>10 μF), and bypassing all power
pins with adequate capacitance (0.1 μF) as close to the part as
possible. The layout of the ADCLK854 evaluation board
(ADCLK854/PCBZ) provides a good layout example.
Exposed Metal Paddle
The exposed metal paddle on the ADCLK854 package is an
electrical connection as well as a thermal enhancement. For the
device to function properly, the paddle must be properly
attached to ground (GND). The ADCLK854 dissipates heat
through its exposed paddle. The PCB acts as a heat sink for the
ADCLK854. The PCB attachment must provide a good thermal
path to a larger heat dissipation area, such as the ground plane
on the PCB. This requires a grid of vias from the top layer down
to the ground plane. See Figure 23 for an example.
Figure 23. PCB Land for Attaching Exposed Paddle
VIAS TO GND PLANE
ADCLK854