ADSP-21160MKBZ-80 Analog Devices Inc, ADSP-21160MKBZ-80 Datasheet - Page 14

• Manufacturer Part Number: ADSP-21160MKBZ-80
• Description: 32bit SHARC W/SIMD Capability
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Floating Pointr

Specifications of ADSP-21160MKBZ-80

• Interface: Host Interface, Link Port, Serial Port
• Clock Rate: 80MHz
• Non-volatile Memory: External
• On-chip Ram: 512kB
• Voltage - I/o: 3.30V
• Voltage - Core: 2.50V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 400-BGA
• Device Core Size: 32b
• Architecture: Enhanced Harvard
• Format: Floating Point
• Clock Freq (max): 80MHz
• Mips: 80
• Device Input Clock Speed: 80MHz
• Ram Size: 512KB
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (min): 2.37/3.13V
• Operating Supply Voltage (max): 2.63/3.47V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 400
• Package Type: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ADSP-21160M
5
6
7
8
9
10
11
12
13
14
15
16
17
18
ABSOLUTE MAXIMUM RATINGS
1
ESD SENSITIVITY
Internal (Core) Supply Voltage (V
Analog (PLL) Supply Voltage (A
External (I/O) Supply Voltage (V
Input Voltage. . . . . . . . . . . . . . . . . . –0.5 V to V
Output Voltage Swing . . . . . . . . . . . –0.5 V to V
Load Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . 200 pF
Storage Temperature Range . . . . . . . . . . . –65ºC to +150ºC
Lead Temperature (5 seconds) . . . . . . . . . . . . . . . . . 185ºC
Applies to input pins with internal pull-ups: DR0, DR1.
Applies to input pins with internal pull-ups: DMARx, TMS, TDI, TRST.
Applies to three-statable pins: DATA63–0, ADDR31–0, PAGE, CLKOUT, ACK, FLAG3–0, REDY, HBG, BMS, BR6–1, TFSx, RFSx, TDO.
Applies to three-statable pins with internal pull-ups: DTx, TCLKx, RCLKx, EMU.
Applies to three-statable pins with internal pull-ups: MS3–0, RDx, WRx, DMAGx, PA, CIF.
internal power measurements made using typical applications are less than specified.
Stresses greater than those listed above may cause permanent damage to the device.
These are stress ratings only. Functional operation of the device at these or any
other conditions greater than those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
CAUTION:
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V
readily accumulate on the human body and test equipment and can discharge without
detection. Although the ADSP-21160M features proprietary ESD protection
circuitry, permanent damage may occur on devices subjected to high-energy electro-
static discharges. Therefore, proper ESD precautions are recommended to avoid
performance degradation or loss of functionality.
Applies to three-statable pins with internal pull-downs: LxDAT7–0, LxCLK, LxACK.
Applies to ACK pulled up internally with 2 k
The test program used to measure I
I
I
Idle denotes ADSP-21160M state during execution of IDLE instruction.
Characterized, but not tested.
Applies to all signal pins.
Guaranteed, but not tested.
DDINHIGH
DDINLOW
is a composite average based on a range of low activity code.
is a composite average based on a range of high activity code.
DD-INPEAK
VDD
DDEXT
DDINT
) . . . . .–0.3 V to +3.0 V
represents worst case processor operation and is not sustainable under normal application conditions. Actual
) . . . .–0.3 V to +4.6 V
)
during reset or ID2–0 = 00x.
1
. . .–0.3 V to +3.0 V
DDEXT
DDEXT
+0.5 V
+0.5 V
For more information, see Power Dissipation on page 42.
For more information, see Power Dissipation on page 42.
–14–
For more information, see Power Dissipation on page 42.
For more information, see Power Dissipation on page 42.
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