CY7C1460AV25-200BZXC Cypress Semiconductor Corp, CY7C1460AV25-200BZXC Datasheet - Page 16

• Manufacturer Part Number: CY7C1460AV25-200BZXC
• Description: CY7C1460AV25-200BZXC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1460AV25-200BZXC

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 36M (1M x 36)
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 165-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Scan Register Sizes
Identification Codes
Document Number: 38-05354 Rev. *G
Instruction
Bypass
ID
Boundary scan order (165-ball FBGA package)
Boundary scan order (209-ball FBGA package)
EXTEST
IDCODE
SAMPLE Z
RESERVED
SAMPLE/PRELOAD
RESERVED
RESERVED
BYPASS
Instruction
Register Name
Code
000
010
100
101
001
011
110
111
Forces all SRAM outputs to high Z state.
TDO. This operation does not affect SRAM operations.
Forces all SRAM output drivers to a high Z state.
Do Not Use: This instruction is reserved for future use.
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Does
not affect SRAM operation.
Do Not Use: This instruction is reserved for future use.
Do Not Use: This instruction is reserved for future use.
Places the bypass register between TDI and TDO. This operation does not affect SRAM
operations.
Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Loads the ID register with the vendor ID code and places the register between TDI and
Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Bit Size (× 36)
32
89
3
1
–
Description
Bit Size (× 18)
32
89
3
1
–
CY7C1460AV25
CY7C1462AV25
CY7C1464AV25
Bit Size (× 72)
138
32
3
1
–
Page 16 of 29
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