CY7C1460AV25-200BZXC Cypress Semiconductor Corp, CY7C1460AV25-200BZXC Datasheet - Page 20

• Manufacturer Part Number: CY7C1460AV25-200BZXC
• Description: CY7C1460AV25-200BZXC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1460AV25-200BZXC

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 36M (1M x 36)
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 165-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Capacitance
Thermal Resistance
AC Test Loads and Waveforms
Note
Document Number: 38-05354 Rev. *G
C
C
C


20. Tested initially and after any design or process change that may affect these parameters.
Parameters
Parameter
IN
CLK
I/O
JA
JC
OUTPUT
OUTPUT
3.3 V I/O Test Load
2.5 V I/O Test Load
Input capacitance
Clock input capacitance
Input/output capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
Z
Z
0
0
[20]
= 50 
= 50 
Description
Description
(a)
(a)
V
V
T
T
= 1.25 V
[20]
= 1.5 V
R
R
L
L
= 50 
= 50 
OUTPUT
OUTPUT
3.3 V
2.5 V
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA/JESD51.
INCLUDING
INCLUDING
JIG AND
JIG AND
V
SCOPE
SCOPE
DD
T
A
Test Conditions
Test Conditions
= 2.5 V V
= 25 °C, f = 1 MHz,
5 pF
5 pF
(b)
(b)
DDQ
R = 317 
R = 1667 
= 2.5 V
R = 351 
R = 1538 
100 TQFP
100 TQFP
Package
V
25.21
Max
GND
GND
2.58
V
DDQ
6.5
5.5
3
DDQ
 1 ns
 1 ns
10%
10%
165 FBGA
165 FBGA
Package
ALL INPUT PULSES
ALL INPUT PULSES
20.8
Max
3.2
7
7
6
90%
90%
(c)
(c)
209 FBGA
CY7C1460AV25
CY7C1462AV25
CY7C1464AV25
Package
209 FBGA
25.31
4.48
Max
5
5
7
90%
90%
10%
10%
Page 20 of 29
°C/W
°C/W
 1 ns
 1 ns
Unit
Unit
pF
pF
pF
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