CY8C3665AXI-016 Cypress Semiconductor Corp, CY8C3665AXI-016 Datasheet - Page 99

CY8C3665AXI-016

CY8C3665AXI-016

Manufacturer Part Number
CY8C3665AXI-016
Description
CY8C3665AXI-016
Manufacturer
Cypress Semiconductor Corp
Series
PSOC™ 3 CY8C36xxr
Datasheets

Specifications of CY8C3665AXI-016

Core Processor
8051
Core Size
8-Bit
Speed
67MHz
Connectivity
EBI/EMI, I²C, LIN, SPI, UART/USART, USB
Peripherals
CapSense, DMA, POR, PWM, WDT
Number Of I /o
62
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.71 V ~ 5.5 V
Data Converters
A/D 2x12b, D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Processor Series
CY8C36
Core
8051
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, UART, USB
Maximum Clock Frequency
67 MHz
Number Of Programmable I/os
28 to 72
Number Of Timers
4
Operating Supply Voltage
0.5 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Controller Family/series
(8051) PSOC 3
No. Of I/o's
62
Eeprom Memory Size
1KB
Ram Memory Size
4KB
Cpu Speed
67MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY8C3665AXI-016
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY8C3665AXI-016T
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
11.4 Memory
Specifications are valid for –40 °C ≤ T
except where noted.
11.4.1 Flash
Table 11-54. Flash DC Specifications
Table 11-55. Flash AC Specifications
11.4.2 EEPROM
Table 11-56. EEPROM DC Specifications
Table 11-57. EEPROM AC Specifications
Document Number: 001-53413 Rev. *K
T
T
T
T
Parameter
Parameter
Parameter
Parameter
WRITE
ERASE
BULK
WRITE
Erase and program voltage
Single row erase/write cycle time
EEPROM data retention time, retention
period measured from last erase cycle
Erase and program voltage
Row write time (erase + program)
Row erase time
Row program time
Bulk erase time (16 KB to 64 KB)
Sector erase time (8 KB to 16 KB)
Total device program time, including
JTAG or SWD, and other overhead
Flash data retention time, retention
period measured from last erase cycle
Description
Description
Description
Description
A
≤ 85 °C and T
J
Average ambient temp, T
1M erase/program cycles
Average ambient temp, T
100 K erase/program cycles
Average ambient temp.
T
cycles
V
Average ambient temp.
T
cycles
Average ambient temp.
T
cycles
A
≤ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V,
A
A
DDD
≤ 85 °C, 10 K erase/program
≤ 55 °C, 100 K erase/program
≤ 85 °C, 10 K erase/program
pin
Conditions
Conditions
Conditions
Conditions
A
A
≤ 25 °C,
≤ 55 °C,
PSoC
1.71
Min
Min
1.71
Min
Min
20
10
20
20
10
®
3: CY8C36 Family
Typ
Typ
Typ
Typ
15
10
5
2
Max
Max
Data Sheet
Max
Max
5.5
20
13
35
15
5.5
20
7
5
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