DSPIC33EP512MU810-I/PT Microchip Technology, DSPIC33EP512MU810-I/PT Datasheet - Page 540
DSPIC33EP512MU810-I/PT
Manufacturer Part Number
DSPIC33EP512MU810-I/PT
Description
100 PINS, 512KB Flash, 52KB RAM, 60 MHz, USB, 2xCAN, 15 DMA 100 TQFP 12x12x1mm T
Manufacturer
Microchip Technology
Series
dsPIC™ 33EPr
Specifications of DSPIC33EP512MU810-I/PT
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
83
Flash Memory Size
536KB
Supply Voltage Range
3V To 3.6V
Operating Temperature Range
-40°C To +85°C
Digital Ic Case Style
TQFP
No. Of Pins
100
Rohs Compliant
Yes
Core Processor
dsPIC
Core Size
16-Bit
Speed
60 MIPs
Connectivity
CAN, I²C, IrDA, LIN, QEI, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
83
Program Memory Size
512KB (170K x 24)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
24K x 16
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33EP512MU810-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC33EP512MU810-I/PT
Manufacturer:
MICRONCHIP
Quantity:
20 000
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DS70616E-page 540
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
c
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
b
e
β
N
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
1 2 3
D
D1
Dimension Limits
Preliminary
NOTE 2
E1
φ
L
Units
A2
A1
E1
D1
L1
N
D
e
A
L
E
b
α
β
φ
c
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
0°
–
L1
MILLIMETERS
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
100
12°
12°
–
–
–
Microchip Technology Drawing C04-110B
2009-2011 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
A2
α
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