CYII5FM1300AB-QDC Cypress Semiconductor Corp, CYII5FM1300AB-QDC Datasheet - Page 31
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CYII5FM1300AB-QDC
Manufacturer Part Number
CYII5FM1300AB-QDC
Description
SENSOR IMAGE 1.3MP CMOS 84-LCC
Manufacturer
Cypress Semiconductor Corp
Type
CMOS Imagingr
Datasheet
1.CYII5FM1300-EVAL.pdf
(35 pages)
Specifications of CYII5FM1300AB-QDC
Pixel Size
6.7µm x 6.7µm
Active Pixel Array
1280H x 1024V
Frames Per Second
27
Voltage - Supply
3 V ~ 4.5 V
Package / Case
84-LCC
Sensor Image Color Type
Monochrome
Sensor Image Size Range
>= 480,000Pixels
Sensor Image Size
1280x1024Pixels
Operating Supply Voltage (min)
3V
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
0C to 65C
Package Type
CLCC
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
84
Package
84CLCC
Image Size
1280x1024 Pixels
Color Sensing
Monochrome
Operating Temperature
0 to 65 °C
Operating Supply Voltage
3 to 3.6 V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Table 27. Side View Dimensions (see
Document #: 38-05710 Rev. *H
Die (with Pin 1 to the left
center, Top View)
Pixel (0,0) is bottom left
Glass lid specifications XY size
Mechanical shock
Vibration
Mounting profile
Dimension
Parameters
C
D
G
H
A
B
E
F
J
Glass (thickness) - mono
Cavity (depth)
Die - Si (thickness) - mono
Bottom layer (thickness)
Die attach-bondline (thickness)
Glass attach-bondline (thickness)
Imager to lid-outer surface
Imager to lid-inner surface
Imager to seating plane of package
Die thickness
Die center, X offset to the center of package
Die center, Y offset to the center of the package
Die position, X tilt to the Die Attach Plane
Die position, Y tilt to the Die Attach Plane
Die placement accuracy (referenced to die scribe and lead
fingers on package on all four sides)
Die rotation accuracy
Distance from PCB plane to top of the die surface
Distance from top of the die surface to top of the glass lid
Thickness
Spectral range for optical coating of window
Reflection coefficient for window (refer to
JESD22-B104C; Condition G
JESD22-B103B; Condition 1
Reflow profile according to J-STD-020D.1
Description
Figure
Figure 30. Side View Dimensions
30) and Mechanical Specifications (see
Description
Figure
0.500
1.520
0.030
0.030
1.270
Min
–
–
–
–
31)
0.550
0.060
0.070
1.570
1.300
(mm)
1.750
0.740
0.500
0.950
Typ
Package Drawing with Glass
0.600
1.980
0.090
1.330
0.110
Max
Min
N/A
N/A
400
–50
–50
–50
NA
0.5
–1
20
–
–
–
–
–
–
–
–
–
–
15 × 15
0.740
1.26
1.69
0.55
<0.8
Typ
CYII5SM1300AB
0
0
1
1
0
–
–
–
–
–
1000
2000
2000
Max
N/A
N/A
260
NA
0.6
50
50
50
1
–
–
–
Page 31 of 35
on page 30)
Units
mm
deg
deg
deg
mm
mm
mm
mm
µm
µm
µm
nm
Hz
°C
%
G
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