BAV99S,115 NXP Semiconductors, BAV99S,115 Datasheet - Page 9

• Manufacturer Part Number: BAV99S,115
• Description: DIODE ARRAY 100V 200MA H-S SC-88
• Manufacturer: NXP Semiconductors

Specifications of BAV99S,115

• Package / Case: SC-70-6, SC-88, SOT-363
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Current - Reverse Leakage @ Vr: 1µA @ 75V
• Current - Average Rectified (io) (per Diode): 200mA (DC)
• Voltage - Dc Reverse (vr) (max): 100V
• Reverse Recovery Time (trr): 4ns
• Diode Type: Standard
• Speed: Small Signal =< 200mA (Io), Any Speed
• Diode Configuration: 2 Pair Series Connection
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.2 A
• Max Surge Current: 4 A
• Configuration: Double Dual Series
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 0.5 uA
• Operating Temperature Range: - 65 C to + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4507-2; 934056610115; BAV99S T/R; BAV99S T/R

NXP Semiconductors
BAV99_SER
Product data sheet
Fig 12. Reflow soldering footprint BAV99S (SOT363/SC-88)
Fig 13. Wave soldering footprint BAV99S (SOT363/SC-88)
4.5
2.35
1.5
All information provided in this document is subject to legal disclaimers.
1.3
(4×)
0.6
(4×)
0.5
Rev. 8 — 18 November 2010
2.45
5.3
(4×)
(4×)
0.5
0.6
1.3
2.65
1.8
(2×)
0.6
1.5
1.5
0.4 (2×)
0.3
2.5
High-speed switching diodes
BAV99 series
Dimensions in mm
direction during soldering
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
preferred transport
sot363_fr
solder lands
solder resist
occupied area
sot363_fw
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