STPS20150CG STMicroelectronics, STPS20150CG Datasheet - Page 4
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STPS20150CG
Manufacturer Part Number
STPS20150CG
Description
DIODE SCHOTTKY 150V 10A D2PAK
Manufacturer
STMicroelectronics
Datasheet
1.STPS20150CFP.pdf
(10 pages)
Specifications of STPS20150CG
Voltage - Forward (vf) (max) @ If
920mV @ 10A
Current - Reverse Leakage @ Vr
5µA @ 150V
Current - Average Rectified (io) (per Diode)
10A
Voltage - Dc Reverse (vr) (max)
150V
Diode Type
Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Configuration
1 Pair Common Cathode
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STPS20150CG
Manufacturer:
ST
Quantity:
20 000
Part Number:
STPS20150CG-TR
Manufacturer:
ST
Quantity:
20 000
Characteristics
4/10
Figure 7.
Figure 9.
Figure 11. Forward voltage drop versus
1E+5
1E+4
1E+3
1E+2
1E+1
1E+0
1E-1
100.0
10.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.1
1.E-03
I (µA)
0
0.0
R
Z
I
FM
th(j-c)
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
TO-220AB, I PAK and D PAK
(A)
0.2
/R
th(j-c)
25
Relative variation of thermal
impedance junction to case versus
pulse duration
Reverse leakage current versus
reverse voltage applied
(typical values, per diode)
forward current (per diode)
T =125°C
2
j
0.4
(typical values)
T =125°C
j
1.E-02
2
50
0.6
0.8
V
t (s)
T =125°C
T =175°C
T =150°C
T =100°C
T =25°C
p
j
j
j
j
j
FM
T =25°C
75
j
(V)
1.0
1.E-01
100
1.2
δ
=tp/T
1.4
125
T
V (V)
Doc ID 7756 Rev 9
1.6
R
tp
1.E+00
1.8
150
Figure 8.
Figure 10. Junction capacitance versus
Figure 12. Thermal resistance junction to
1000
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
80
70
60
50
40
30
20
10
10
0
1.E-03
0
R
1
C(pF)
Z
th(j-a)
th(j-c)
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
TO-220FPAB
(°C/W)
5
/R
2
th(j-c)
Relative variation of thermal
impedance junction to case versus
pulse duration (TO-220FPAB)
reverse voltage applied
(typical values, per diode)
ambient versus copper surface
under tab
1.E-02
10
5
Epoxy printed circuit board, copper thickness = 35 µm
15
10
S(cm²)
1.E-01
t (s)
V (V)
p
20
R
(STPS20150CG only)
20
25
1.E+00
30
50
δ
=tp/T
STPS20150C
T
100
35
F=1MHz
T =25°C
j
tp
1.E+01
40
200