BAT30SFILM STMicroelectronics, BAT30SFILM Datasheet - Page 4
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BAT30SFILM
Manufacturer Part Number
BAT30SFILM
Description
DIODE SCHOTTKY 300MA SER SOT-23
Manufacturer
STMicroelectronics
Datasheet
1.BAT30SWFILM.pdf
(14 pages)
Specifications of BAT30SFILM
Voltage - Forward (vf) (max) @ If
530mV @ 300mA
Current - Reverse Leakage @ Vr
5µA @ 30V
Current - Average Rectified (io) (per Diode)
300mA (DC)
Voltage - Dc Reverse (vr) (max)
30V
Diode Type
Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Configuration
1 Pair Series Connection
Mounting Type
Surface Mount
Package / Case
SOT-23-3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Other names
497-5700-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAT30SFILM
Manufacturer:
ST
Quantity:
20 000
Characteristics
4/14
Figure 5.
Figure 7.
Figure 9.
1.E+00
1.E+00
600
500
400
300
200
1.E-01
1.E-02
1.E-01
1.E-02
1.E-03
0
1.E-03
1.E-03
Single pulse
Single pulse
5
SOD-523
SOT-666
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Thermal resistance junction to
ambient versus copper surface
under each lead (SOD-323)
10
1.E-02
1.E-02
15
20
S
CU
(mm²)
t
1.E-01
t
1.E-01
P
P
25
(s)
(s)
30
Epoxy printed board FR4
Coppr thickness = 35 µm
Epoxy printed board FR4
Coppr thickness = 35 µm
Epoxy printed board FR4
Copper thichness = 35 µm
35
1.E+00
1.E+00
40
45
Doc ID 12564 Rev 3
1.E+01
1.E+01
50
Figure 6.
Figure 8.
Figure 10. Leakage current versus reverse
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
1.E+00
900
800
700
600
500
400
300
200
100
1.E-01
1.E-02
1.E-01
1.E-02
0
0.0
1.E-03
0
I R (µA)
Single pulse
0.2
SOD-923
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Thermal resistance junction to
ambient versus copper surface
under each lead (SOD-923)
applied voltage (typical values)
1.E-02
0.4
5
0.6
1.E-01
10
0.8
1.E+00
T
T
T
T
1.0
j
j
=150°C
=125°C
j
j
=85°C
=25°C
15
1.2
1.E+01
Epoxy printed board FR4
Copper thichness = 35 µm
20
1.4
1.E+02
1.6
t
P
S
(s)
CU
25
V
(cm²)
R
(V)
1.8
1.E+03
BAT30
2.0
30