BAS32L,115 NXP Semiconductors, BAS32L,115 Datasheet
BAS32L,115
Specifications of BAS32L,115
933913910115
BAS32L T/R
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BAS32L,115 Summary of contents
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BAS32L High-speed switching diode Rev. 7 — 20 January 2011 1. Product profile 1.1 General description Single high-speed switching diode, fabricated in planar technology, and encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package. 1.2 Features and ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking band indicates the cathode. 3. Ordering information Table 3. Type number BAS32L 4. Marking Table 4. Type number BAS32L 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V RRM FRM I FSM ...
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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint °C prior to surge. [ Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors 300 I F (mA) 200 100 0 0 100 FR4 PCB, standard footprint Fig 1. Forward current as a function of ambient temperature; derating curve FSM ( − Based on square wave currents °C prior to surge T j Fig 3. Non-repetitive peak forward current as a function of pulse duration; maximum values ...
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... NXP Semiconductors = 25 ° MHz Fig 5. Diode capacitance as a function of reverse voltage; typical values 8. Test information D.U.T. I Ω × Input signal: Reverse pulse rise time t Oscilloscope: Rise time Fig 6. Reverse recovery time test circuit and waveforms I 450 Ω 1 kΩ Ω ...
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... NXP Semiconductors 9. Package outline Fig 8. 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAS32L [1] For further information and the availability of packing methods, see BAS32L Product data sheet 0.3 3.7 3.3 ...
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... NXP Semiconductors 11. Soldering Fig 9. 2.90 Fig 10. Wave soldering footprint SOD80C BAS32L Product data sheet 4.55 4.30 2.30 2.25 1.70 1.60 0.90 (2x) Reflow soldering footprint SOD80C 6.30 4.90 2.70 1.90 1.70 All information provided in this document is subject to legal disclaimers. Rev. 7 — 20 January 2011 ...
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... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date BAS32L v.7 20110120 • Modifications: Table 4 “Marking • Section 13 “Legal BAS32L v.6 20081029 BAS32L v.5 20080103 BAS32L v.4 20050322 BAS32L v.3 20020123 BAS32L v.2 19960910 BAS32L v.1 19960423 BAS32L Product data sheet ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information . . . . . . . . . . . . . . . . . . . . . 6 11 Soldering ...