STPS1150A STMicroelectronics, STPS1150A Datasheet - Page 5

• Manufacturer Part Number: STPS1150A
• Description: DIODE SCHOTTKY 1A 150V SMA
• Manufacturer: STMicroelectronics

Specifications of STPS1150A

• Voltage - Forward (vf) (max) @ If: 820mV @ 1A
• Voltage - Dc Reverse (vr) (max): 150V
• Current - Average Rectified (io): 1A
• Current - Reverse Leakage @ Vr: 1µA @ 150V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Mounting Type: Surface Mount
• Package / Case: DO-214AC, SMA
• Product: Schottky Rectifiers
• Peak Reverse Voltage: 150 V
• Forward Continuous Current: 1 A
• Max Surge Current: 50 A
• Configuration: Single
• Forward Voltage Drop: 0.89 V at 2 A
• Maximum Reverse Leakage Current: 1 uA
• Operating Temperature Range: + 175 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-7545-2; STPS1150A

STPS1150
Figure 13. Reverse leakage current versus
Figure 15. Forward voltage drop versus
Figure 17. Thermal resistance junction to
250
225
200
175
150
125
100
75
50
25
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.E-01
1.E-02
1.E-03
0
0.0
0.0
R
I
FM
th(j-a)
0
I (µA)
(A)
R
0.5
(°C/W)
0.1
1.0
reverse voltage applied (typical
values)
forward current (all packages)
0.2
ambient versus copper surface
under tab (STmite flat)
25
1.5
0.3
50
0.4
2.0
(typical values)
T =150°C
T =125°C
T =100°C
T =75°C
T =50°C
T =25°C
T =125°C
V (V)
j
j
j
j
j
j
j
0.5
2.5
R
STmite flat
75
(maximum values)
T =125°C
j
0.6
3.0
Epoxy printed circuit board,
copper thickness = 35 µm
100
0.7
3.5
V
FM
(V)
0.8
4.0
(maximum values)
125
T =25°C
S (cm²)
j
0.9
Cu
Doc ID 9472 Rev 5
4.5
150
1.0
5.0
Figure 14. Junction capacitance versus
Figure 16. Thermal resistance junction to
Figure 18. Thermal resistance junction to
250
225
200
175
150
125
100
75
50
25
100
130
120
110
100
0
10
90
80
70
60
50
40
30
20
10
0.0
1
0
R
0.0
1
R
C(pF)
th(j-a)
th(j-a)
0.5
(°C/W)
0.5
(°C/W)
1.0
reverse voltage applied (typical
values)
ambient versus copper surface
under tab (STmite)
ambient versus copper surface
under each lead (SMA)
1.0
1.5
1.5
10
2.0
2.0
STmite
S (cm²)
V (V)
Cu
2.5
2.5
R
Epoxy printed circuit board,
copper thickness = 35 µm
3.0
3.0
Epoxy printed circuit board,
copper thickness = 35 µm
100
3.5
3.5
Characteristics
4.0
4.0
V
OSC
F=1MHz
T =25°C
=30mV
j
S (cm²)
4.5
Cu
4.5
RMS
1000
5.0
5/11
5.0