STPS2150A STMicroelectronics, STPS2150A Datasheet - Page 5

• Manufacturer Part Number: STPS2150A
• Description: DIODE SCHOTTKY 150V 2A SMA
• Manufacturer: STMicroelectronics

Specifications of STPS2150A

• Voltage - Forward (vf) (max) @ If: 820mV @ 2A
• Voltage - Dc Reverse (vr) (max): 150V
• Current - Average Rectified (io): 2A
• Current - Reverse Leakage @ Vr: 1.5µA @ 150V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Mounting Type: Surface Mount
• Package / Case: DO-214AC, SMA
• Product: Schottky Diodes
• Peak Reverse Voltage: 150 V
• Forward Continuous Current: 2 A
• Max Surge Current: 75 A
• Configuration: Single
• Forward Voltage Drop: 0.89 V @ 4 A
• Maximum Reverse Leakage Current: 1.5 uA
• Operating Temperature Range: + 175 C
• Mounting Style: SMD/SMT
• Rectifier Type: Schottky Diode
• Peak Rep Rev Volt: 150V
• Avg. Forward Curr (max): 2A
• Rev Curr: 1.5uA
• Peak Non-repetitive Surge Current (max): 75A
• Forward Voltage: 0.89V
• Operating Temp Range: -65C to 175C
• Package Type: SMA
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-2467-2

STPS2150
Figure 13. Forward voltage drop versus
Figure 15. Thermal resistance junction to
140
120
100
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
80
60
40
20
0
0.0
I
R
0
FM
th(j-a)
(A)
(°C/W)
0.2
Figure 17. Thermal resistance versus lead length (DO-15)
forward current (maximum values,
low level)
ambient versus copper surface
under each lead - epoxy printed
circuit board FR4, copper
thickness = 35 µm (SMA)
(Maximum values)
(Maximum values)
1
T
T
(Typical values)
(Typical values)
j
j
=125°C
=125°C
T
T
j
j
=125°C
=125°C
0.4
2
S (cm²)
Cu
0.6
120
100
V
80
60
40
20
0
FM
3
5
R (°C/W)
(V)
th
0.8
(Maximum values)
T
j
=25°C
4
1.0
10
SMA
1.2
5
L
leads
R
R
Figure 14. Forward voltage drop versus
Figure 16. Thermal resistance junction to
th(j-a)
15
th(j-I)
(mm)
100
200
180
160
140
120
100
10
80
60
40
20
1
0
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
R
I
FM
th(j-a)
(A)
0.2
(°C/W)
20
forward current (maximum values,
high level)
ambient versus copper surface
under each lead - epoxy printed
circuit board FR4, copper
thickness = 35 µm (SMAflat)
0.4
0.6
(typical values)
T =125°C
25
j
0.8
S (cm²)
Cu
V
FM
(maximum values)
(V)
1.0
T =125°C
j
1.2
Characteristics
(maximum values)
T =25°C
1.4
j
1.6
SMAflat
1.8
5/9