STTH2L06U STMicroelectronics, STTH2L06U Datasheet
STTH2L06U
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STTH2L06U Summary of contents
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... October 2009 High efficiency ultrafast diode SMA STTH2L06A Table 1. Device summary Symbol I F(AV) V RRM (typ (max) rr Doc ID10758 Rev 2 STTH2L06 A K DO-41 STTH2L06 SMB STTH2L06U Value 2 A 600 V 175 °C 0. 1/9 www.st.com 9 ...
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Characteristics 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol V Repetitive peak reverse voltage RRM I Forward rms current F(RMS) Average forward current, δ = 0.5 I F(AV) I Surge non repetitive forward current FSM T Storage temperature range ...
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STTH2L06 Table 5. Dynamic electrical characteristics Symbol Parameter t Reverse recovery time rr t Forward recovery time fr V Forward recovery voltage FP Figure 1. Conduction losses vs average forward current P(W) 2.5 δ = 0.2 δ = 0.1 δ ...
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Characteristics Figure 5. Relative variation of thermal impedance junction to case vs pulse duration (DO-41 th(j-a) th(j-a) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse 0.1 t (s) p 0.0 1.E-02 1.E-01 1.E+00 1.E+01 Figure ...
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STTH2L06 Figure 11. Forward recovery time vs dI (typical values) t (ns) fr 400 350 300 250 200 150 100 50 dI /dt(A/µ 100 Figure 13. Thermal resistance junction to ambient vs copper surface under tab ...
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Package information 2 Package information ● Epoxy meets UL 94, V0 ● Band indicates cathode ● Bending method (DO-41): see Application note AN1471 In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, ...
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STTH2L06 Figure 15. Footprint (dimensions in mm) Table 8. SMB dimensions Figure 16. Footprint (dimensions in mm) 2.63 1.4 5.43 Ref 1.62 2.60 1.62 ...
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... Ordering information 3 Ordering information Table 9. Ordering information Order code STTH2L06 STTH2L06RL STTH2L06A STTH2L06U 4 Revision history Table 10. Document revision history Date 07-Sep-2004 30-Sep-2009 8/9 Marking Package STTH2L06 DO-41 STTH2L06 DO-41 L6A SMA L6U SMB Revision 1 First issue. 2 Updated table 6 package dimensions. Doc ID10758 Rev 2 ...
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... STTH2L06 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...