STTH102 STMicroelectronics, STTH102 Datasheet - Page 4
STTH102
Manufacturer Part Number
STTH102
Description
IC DIODE ULTRAFAST 220V 1A DO-41
Manufacturer
STMicroelectronics
Datasheet
1.STTH102RL.pdf
(7 pages)
Specifications of STTH102
Voltage - Forward (vf) (max) @ If
970mV @ 1A
Voltage - Dc Reverse (vr) (max)
220V
Current - Average Rectified (io)
1A
Current - Reverse Leakage @ Vr
1µA @ 220V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
20ns
Mounting Type
Through Hole
Package / Case
DO-204AL, DO-41, Axial
Product
Ultra Fast Recovery Rectifier
Configuration
Single
Reverse Voltage
200 V
Forward Voltage Drop
0.97 V
Recovery Time
20 ns
Forward Continuous Current
1 A
Max Surge Current
50 A
Reverse Current Ir
1 uA
Mounting Style
Through Hole
Maximum Operating Temperature
+ 175 C
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Capacitance @ Vr, F
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-3666-2
497-3666-2
497-3666-3
497-3666-2
497-3666-3
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STTH102
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
STTH102A
Manufacturer:
AVAGO
Quantity:
340
Company:
Part Number:
STTH102A
Manufacturer:
STMicroelectronics
Quantity:
60 000
Part Number:
STTH102A
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
STTH102RL
Manufacturer:
STMicroelectronics
Quantity:
7 996
Company:
Part Number:
STTH102RL
Manufacturer:
ST
Quantity:
5 000
Characteristics
4/7
Figure 9.
Figure 11. Reverse recovery charges versus
Figure 13. Thermal resistance junction to
70
60
50
40
30
20
10
35.0
32.5
30.0
27.5
25.0
22.5
20.0
17.5
15.0
12.5
10.0
120
110
100
0
7.5
5.0
2.5
0.0
90
80
70
60
50
40
30
20
10
0
1
0.0
t (ns)
rr
R
1
Q (nC)
th(j-a)
rr
I =1A
V =100V
F
R
0.5
(°C/W)
Reverse recovery time versus dI
(90% confidence)
dI
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMA)
1.0
F
/dt (90% confidence)
1.5
10
10
2.0
dI /dt(A/µs)
dI /dt(A/µs)
F
F
S(cm²)
T =25°C
j
T =125°C
2.5
j
T =125°C
j
3.0
100
100
3.5
T =25°C
j
4.0
I =1A
V =100V
T =125°C
F
4.5
R
j
1000
1000
F
5.0
/dt
Figure 10. Peak recovery current versus dI
Figure 12. Relative variations of dynamic
Figure 14. Thermal resistance versus
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.5
3.0
2.5
2.0
1.5
1.0
120
110
100
90
80
70
60
50
40
30
20
10
0
25
1
I
I
5
RM
RM
R (°C/W)
th
(A)
I =1A
V =100V
T =125°C
; t ; Q [T ] /
F
dI /dt=200A/µs
j
R
F
V =100V
rr
I =I
F
R
F(AV)
50
rr
(90% confidence)
parameters versus junction
temperature
lead length (DO-41)
j
10
I
RM
10
75
; t ; Q [T =25°C]
rr
dI /dt(A/µs)
L
F
leads
rr
100
R
T (°C)
R
th(j-a)
15
th(j-I)
j
(mm)
j
T =125°C
j
100
125
T =25°C
j
20
Q
I
RR
RM
150
t
STTH102
rr
F
1000
175
/dt
25